LNP™ LUBRICOMP™ Compound EX00548C

Chemical Family: Polyetherimide (PEI)Polyimides (PI)

SABIC's Specialties Business LNP LUBRICOMP EX00548C compound is based on Polyetherimide (PEI) resin containing proprietary fillers. Added features of this grade include: LNP Clean Compounding Technology, Wear Resistant.

Product families

Applications

Consumer Goods — Appliances & Electronics

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays
Industrial Automation

Electrical & Electronics — Parts & Components

Connectors
Semiconductor Manufacturing
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ LUBRICOMP™ Compound
Polymer Name: Polyether Imide (PEI)
Fillers Included: Proprietary
Flexural Modulus: 3440.0 - 3440.0 MPa
Additives Included: Lubricant (Unspecified), Proprietary
Lubricant (Unspecified)
Proprietary
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Industrial
Flame Rating: UL 94 V0
Technology: Plastics
Material Features: High Temperature Resistance
Low Liquid Particle Count
Low Outgassing
Lubricated
Very Good Heat Resistance
Wear Resistant
Certifications and Compliance: UL 94
Plastics and Elastomers End Uses: Cell Phones
Computer Components
Displays
Electrical Components
Electrical/Electronic Applications
Industrial Applications
Semiconductor Applications
Tablets
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

14 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield) ¹¹	85	MPa	ASTM D638
Tensile Stress (Yield) ¹¹	86	MPa	ISO 527
Tensile Stress (Break) ¹¹	83	MPa	ASTM D638
Tensile Stress (Break) ¹¹	85	MPa	ISO 527
Tensile Strain (Yield) ¹¹	6	%	ISO 527
Tensile Strain (Yield) ¹¹	6.1	%	ASTM D638
Tensile Strain (Break) ¹¹	7.6	%	ISO 527
Tensile Strain (Break) ¹¹	8.1	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	3030	MPa	ASTM D638
Flexural Stress ¹¹	148	MPa	ASTM D790
Flexural Stress ¹¹	143	MPa	ISO 178
Flexural Modulus ¹¹	3440	MPa	ASTM D790

Table 2 of 6

7 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.31	g/cm³	ISO 1183
Density ¹¹	1.31	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.22	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.7	%	ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.66	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.7	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.7	%	ISO 294

Table 3 of 6

5 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	185	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	184	°C	ISO 75/Af
Relative Temperature Index (Electrical) ᵖ ¹¹	105	°C	UL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹	105	°C	UL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹	105	°C	UL 746B

Table 4 of 6