LNP™ STAT-KON™ Compound ZJK20I
SABIC's Specialties Business LNP™ STAT-KON™ ZJK20I is a static dissipative CNT compound based on polyphenylene ether (PPE) + polystyrene (PS) resin with low particulate count and good high heat properties. This material is an excellent candidate for IC tray, Wafer cassette and Slider tray parts in the semiconductor industry.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Equipment & Parts
- Consumer Electronics
- Industrial Automation
- Connectors
- Housings & Enclosures
- Semiconductor Manufacturing
- Sensors & Actuators
- Switches & Relays
Product Families
- Blends & Alloys
Other characteristics
- Brand
- LNP™ STAT-KON™ Compound
- Density
- 1150.0 - 1150.0 kg/m³
- Polymer Name
- PPO/PS Alloy
- Flexural Modulus
- 4020.0 - 4020.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Fillers Included
- Carbon Nanotube
- Additives Included
- Anti-Static Agent
- Mold Release Agent
- Material Features
- Anti-Static
- Conductive
- Dimensional Stability
- ESD Protection
- Easy To Mold
- Electrically Conductive
- Good Mold Release
- Good Moldability
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Cart
- Cash Dispenser (ATM)
- Covers
- Disk Caddy
- Electrical Components
- Electrical/Electronic Applications
- Electronic Components
- Enclosure
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melt Volume Rate (at 300°C, 10.0 kg) ¹¹ | 11 | cm³/10 min | ISO 1133 |
| Density ¹¹ | 1.15 | g/cm³ | ISO 1183 |
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.27 | % | SABIC method |
| Mold Shrinkage (xflow) ᵍ ¹¹ | 0.31 | % | SABIC method |
| Specific Gravity ¹¹ | 1.15 | — | ASTM D792 |
Table 2 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, 50 mm/min) ¹¹ | 85 | MPa | ISO 527 |
| Tensile Strain (Break, 50 mm/min) ¹¹ | 3.6 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 4200 | MPa | ISO 527 |
| Flexural Strength (at 2 mm/min) ¹¹ | 124 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 4020 | MPa | ISO 178 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹¹ | 82 | MPa | ASTM D638 |
| Tensile Stress (Yield, Type I, 50 mm/min) ¹¹ | 85 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 50 mm/min) ¹¹ | 4.20E+00 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 5 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 4320 | MPa | ASTM D638 |
| Flexural Strength (at 1.3 mm/min, 50 mm span) ¹¹ | 133 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 4320 | MPa | ASTM D790 |
Table 3 of 6
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000047 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000061 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 153 | °C | ISO 75/Af |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 164 | °C | ISO 75/Bf |
| Ball Pressure Test (at 123°C to 127°C) ¹¹ | Pass | — | IEC 60695-10-2 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 153 | °C | ASTM D648 |
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 164 | °C | ASTM D648 |
Table 4 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity ¹¹ | 100000 - 100000000 | Ω | ANSI/ESD STM11.11 |
| Surface Resistivity ¹¹ | 100000 - 100000000 | Ω | ASTM D257 |
| Volume Resistivity ¹¹ | 1 - 100 | Ω.cm | SABIC method |
Table 5 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 30 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 4 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 345 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 38 | J/m | ASTM D256 |
Table 6 of 6
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Drying Temperature ⁷ | 80 - 100 | °C |
| Drying Time ⁷ | 2 - 4 | Hrs |
| Front - Zone 3 Temperature ⁷ | 310 - 320 | °C |
| Hopper Temperature ⁷ | 40 | °C |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 310 - 320 | °C |
| Middle - Zone 2 Temperature ⁷ | 300 - 310 | °C |
| Mold Temperature ⁷ | 100 - 120 | °C |
| Nozzle Temperature ⁷ | 310 - 320 | °C |
| Rear - Zone 1 Temperature ⁷ | 300 - 310 | °C |
| Screw Speed (Circumferential speed) ⁷ | 0.15 - 0.2 | m/s |
