LNP™ THERMOCOMP™ Compound LF006
- Chemical Family
- Polyether Ether Ketone (PEEK)
SABIC's Specialties Business LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Оборудование и детали
- Бытовая электроника
- Дисплеи
- Промышленная автоматизация
- Разъемы
- Корпуса и оболочки
- Производство полупроводников
- Выключатели и реле
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyetheretherketone (PEEK)
- Fillers Included
- Glass Fiber
- Processing Methods
- Injection Molding
- Note
⁷ Параметры литья под давлением упоминаются только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных изделий и газовое литье.; ¹¹ Информация, указанная в технических паспортах, должна использоваться только в качестве ориентировочной для целей выбора материала и не должна использоваться в качестве спецификации или для проектирования деталей или пресс-форм.; ᵖ Рейтинги UL, указанные в техническом паспорте, могут не охватывать весь диапазон толщин и цветов. Для получения подробной информации, пожалуйста, обратитесь к карточке UL Yellow Card.
- Markets
- Потребительские товары
- Электрика и электроника
- Промышленность
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- High Modulus
- High Stiffness
- High Temperature Resistance
- No Added PFAS
- Very Good Heat Resistance
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Appliances
- Cell Phones
- Commercial Appliance
- Computer Components
- Displays
- Electrical Components
- Electrical Enclosure
- Electrical Internal Frame
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
16 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, 5 mm/min) ¹¹ | 152 | MPa | ISO 527 |
| Tensile Stress (Break) ¹¹ | 175 | MPa | ISO 527 |
| Tensile Stress (Break) ¹¹ | 176 | MPa | ASTM D638 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1.9 | % | ISO 527 |
| Tensile Strain (Break) ¹¹ | 2 | % | ASTM D638 |
| Tensile Strain (Break) ¹¹ | 1.9 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 11100 | MPa | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 13100 | MPa | ISO 527 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 13230 | MPa | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 13230 | MPa | ASTM D638 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 217 | MPa | ISO 178 |
| Flexural Stress ¹¹ | 245 | MPa | ASTM D790 |
Table 2 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.53 | g/cm³ | ISO 1183 |
| Density ¹¹ | 1.54 | g/cm³ | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.1 | % | ASTM D570 |
| Moisture Absorption (at 23°C, 50% RH) ¹¹ | 0.08 | % | ISO 62 |
Table 3 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹ | 0.00002 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹ | 0.000046 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | min. 240 | °C | ISO 75/Af |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | min. 280 | °C | ISO 75/Af |
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | min. 298 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2 mm, Unannealed) ¹¹ | min. 298 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.0000162 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000018 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000017 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.0000468 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.0000484 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | min. 240 | °C | ISO 75/Bf |
Table 4 of 6
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 57 | kJ/m² | ISO 180/1U |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 45 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 11 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 9 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 875 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 117 | J/m | ASTM D256 |
| Instrumented Dart Impact Energy (Peak, at 23°C) ¹¹ | 13 | J | ASTM D3763 |
Table 5 of 6
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 150 | °C |
| Drying Temperature ⁷ | 120 - 150 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Front - Zone 3 Temperature ⁷ | 380 - 400 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 395 | °C |
| Maximum Moisture Content ⁷ | 0.1 | % |
| Melt Temperature ⁷ | 380 - 390 | °C |
| Middle - Zone 2 Temperature ⁷ | 380 - 400 | °C |
| Middle - Zone 2 Temperature ⁷ | 365 - 375 | °C |
| Rear - Zone 1 Temperature ⁷ | 370 - 380 | °C |
| Rear - Zone 1 Temperature ⁷ | 350 - 360 | °C |
Table 6 of 6
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94V-0 Flame Class Rating) ᵖ | 0.78 | mm | UL 94 |
