LNP™ THERMOCOMP™ Compound ZKC08
SABIC's Specialties Business LNP THERMOCOMP ZKC08 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 40% minerals and impact modifier. Added features of this grade include: High Dielectric Constant (Dk), Extremely Low Dissipation Factor (Df), Good Ductility and Good Thermal Performance,High Impact Resistance. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Interior
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Blends & Alloys
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Density
- 1430.0 - 1430.0 kg/m³
- Polymer Name
- PPO/PS Alloy
- Flexural Modulus
- 2230.0 - 2230.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Fillers Included
- Mineral
- Titanium Dioxide
- Additives Included
- Heat Stabilizer
- Impact Modifier
- Material Features
- Cost Effective
- Excellent Dielectric Properties
- Heat Stabilized
- High Ductility
- High Impact Resistance
- Impact Modified
- Low Warpage
- No Added PFAS
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Automotive Interior Parts
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Electrical Enclosure
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 7
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.43 | g/cm³ | ASTM D792 |
| Melt Flow Rate (at 300°C, 10 kgf) ¹¹ | 31 | g/10 min | ASTM D1238 |
| Melt Flow Rate (at 300°C, 5.0 kgf) ¹¹ | 9.5 | g/10 min | ASTM D1238 |
| Melt Volume Rate (at 300°C, 10.0 kg) ¹¹ | 23.5 | cm³/10 min | ISO 1133 |
| Melt Volume Rate (at 300°C, 5.0 kg) ¹¹ | 7 | cm³/10 min | ISO 1133 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.75 - 0.85 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.75 - 0.85 | % | ASTM D955 |
| Water Absorption (at 23°C, 24hrs) ¹¹ | 0.03 | % | ISO 62-1 |
Table 2 of 7
14 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹ | 65 | MPa | ASTM D790 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 63 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 2000 | MPa | ASTM D790 |
| Tensile Stress (Yield, Type I, 50 mm/min) ¹¹ | 43 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹¹ | 36 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 50 mm/min) ¹¹ | 7.8 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 8.9 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 2170 | MPa | ASTM D638 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 72 | MPa | ISO 178 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 70 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 2230 | MPa | ISO 178 |
| Tensile Stress (Break, 50 mm/min) ¹¹ | 42 | MPa | ISO 527 |
Table 3 of 7
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 148 | °C | ASTM D648 |
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 173 | °C | ASTM D648 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 149 | °C | ISO 75/Af |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 174 | °C | ISO 75/Bf |
| Coefficient of Thermal Expansion (at -40°C to 150°C, flow) ¹¹ | 0.000061 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 150°C, xflow) ¹¹ | 0.000083 | 1/°C | ASTM E831 |
| Relative Temperature Index (Electrical) ᵖ ¹¹ | 65 | °C | UL 746B |
| Relative Temperature Index (Mechanical with impact) ᵖ ¹¹ | 65 | °C | UL 746B |
| Relative Temperature Index (Mechanical without impact) ᵖ ¹¹ | 65 | °C | UL 746B |
Table 4 of 7
8 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹¹ | 3.91 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.0009 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 3.93 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.0012 | SABIC method |
| Dielectric Constant (at 5 GHz) ¹¹ | 3.95 | SABIC method |
| Dissipation Factor (at 5 GHz) ¹¹ | 0.0018 | SABIC method |
| Dielectric Constant (at 10 GHz) ¹¹ | 3.93 | SABIC method |
| Dissipation Factor (at 10 GHz) ¹¹ | 0.0021 | SABIC method |
Table 5 of 7
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 205 | J/m | ASTM D256 |
| Izod Impact (Notched, at -20°C) ¹¹ | 166 | J/m | ASTM D256 |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 21 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched, 80*10*4, at -20°C) ¹¹ | 16 | kJ/m² | ISO 180/1A |
Table 6 of 7
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 105 | °C |
| Drying Time ⁷ | 3 - 5 | Hrs |
| Melt Temperature ⁷ | 285 - 320 | °C |
| Nozzle Temperature ⁷ | 280 - 320 | °C |
| Front - Zone 3 Temperature ⁷ | 285 - 320 | °C |
| Middle - Zone 2 Temperature ⁷ | 280 - 310 | °C |
| Rear - Zone 1 Temperature ⁷ | 275 - 300 | °C |
| Mold Temperature ⁷ | 90 - 120 | °C |
| Back Pressure ⁷ | 0.3 - 0.9 | MPa |
| Screw Speed ⁷ | 50 - 150 | rpm |
Table 7 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94HB Flame Class Rating) ᵖ | 1 | mm | UL 94 |
