LNP™ THERMOCOMP™ Compound QF008

Chemical Family: Polyamides

LNP THERMOCOMP QF008 compound is based on Nylon 6/10 resin containing 40% glass fiber.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Lawn & Garden
Consumer Goods — Sports & Recreation

Building & Construction — Decorative Materials & Finishes

Artificial Turf

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyamide 610 (PA 610)
Fillers Included: Glass Fiber
Flexural Modulus: 10790.0 - 10790.0 MPa
Additives Included: Heat Stabilizer, Mold Release Agent
Heat Stabilizer
Mold Release Agent
Processing Methods: Injection Molding
Note: ⁷ Параметры литья под давлением упоминаются только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных деталей и газовое литье.. ¹¹ Информация, указанная в технических паспортах, должна использоваться только в качестве ориентировочной для целей выбора материала и не должна использоваться в качестве спецификации или для проектирования деталей или пресс-форм.
Markets: Building & Construction
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Material Features: Cost Effective
Good Mold Release
Heat Stabilized
High Modulus
High Stiffness
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Appliances
Building Materials
Cell Phones
Commercial Appliance
Computer Components
Consumer Applications
Containers
Displays
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

7 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break) ¹¹	183	MPa	ISO 527
Tensile Stress (Break) ¹¹	171	MPa	ASTM D638
Tensile Strain (Break) ¹¹	3.3	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	12420	MPa	ASTM D638
Flexural Stress ¹¹	255	MPa	ASTM D790
Flexural Modulus ¹¹	10790	MPa	ASTM D790
Flexural Modulus ¹¹	10780	MPa	ISO 178

Table 2 of 5

2 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.41	g/cm³	ASTM D792
Density ¹¹	1.42	g/cm³	ISO 1183

Table 3 of 5

3 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	219	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	207	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	214	°C	ISO 75/Af

Table 4 of 5