LNP™ THERMOCOMP™ Compound MB008S

Chemical Family: PolyolefinsPolypropylenes (PP)

LNP THERMOCOMP MB008S compound is based on Polypropylene (PP) resin containing 40% glass bead. Added features of this grade include: Heat Stabilized.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Sports & Recreation

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Basic Thermoplastics

Polyolefins

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polypropylene (unspecified)
Fillers Included: Glass Bead, Glass Fiber
Glass Bead
Glass Fiber
Additives Included: Heat Stabilizer, Mold Release Agent
Heat Stabilizer
Mold Release Agent
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Material Features: Cost Effective
Dimensional Stability
Good Mold Release
Heat Stabilized
High Stiffness
Low Warpage
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Electrical Components
Electrical Enclosure
Electrical Internal Frame
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

14 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield) ¹¹	19	MPa	ASTM D638
Tensile Stress (Yield) ¹¹	19	MPa	ISO 527
Tensile Stress (Break) ¹¹	15	MPa	ASTM D638
Tensile Stress (Break) ¹¹	15	MPa	ISO 527
Tensile Strain (Yield) ¹¹	6	%	ASTM D638
Tensile Strain (Yield) ¹¹	6.1	%	ISO 527
Tensile Strain (Break) ¹¹	43.8	%	ISO 527
Tensile Strain (Break) ¹¹	160	%	ASTM D638
Tensile Modulus (at 1 mm/min) ¹¹	1660	MPa	ISO 527
Flexural Stress ¹¹	27	MPa	ASTM D790
Flexural Stress ¹¹	36	MPa	ISO 178
Flexural Modulus ¹¹	2200	MPa	ISO 178

Table 2 of 5

6 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.21	g/cm³	ISO 1183
Density ¹¹	1.22	g/cm³	ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	1.2 - 1.4	%	ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	1.3	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	1.3 - 1.5	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	1.4	%	ISO 294

Table 3 of 5

8 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	61	°C	ISO 75/Af
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	103	°C	ISO 75/Bf
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000072	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000664	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.0000767	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.0000072	1/°C	ASTM E831
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	102	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	60	°C	ASTM D648

Table 4 of 5