LNP™ THERMOCOMP™ Compound FX10009
- Chemical Family
- PolyethylenesPolyolefins
LNP THERMOCOMP FX10009 compound is based on Polyethylene (PE) resin containing proprietary fillers. Added features of this grade include: Improved Dielectric Properties.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Interior
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polyolefins
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyethylene (unspecified)
- Fillers Included
- Mineral
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Material Features
- Cost Effective
- Electrically Conductive
- Excellent Dielectric Properties
- Unreinforced
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Automotive Applications
- Automotive Interior Parts
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Compounds for Dielectric Solutions
LNP™ THERMOCOMP compounds portfolio contains thermoplastic injection molding materials that offer low Dissipation Factor (Df ) for improved signal gain and longer reading distance paired with tailor made Dielectric Constants (Dk ) to fine tune or detour a signal direction supporting innovative antenna designs. Beyond that, THERMOCOMP compounds allow further antenna miniaturization and the design of phase shifters with higher productivity through combined high Dk and low Df material properties.; Materials for individual antenna design to fine tune or detour signal direction.; Improved signal gain and longer reading distance through less signal attenuation.; Miniaturized antenna solutions with sufficient signal strength for 5G technology.; Improved mechanical performance versus Epoxy or Ceramics in more complex designs for less maintenance through longer lifetime.; Tailored Dielectric Constant Dk by customized compound formulations.; Very low Dissipation Factor Df for lower signal absorption, less signal scattering.; Combined high Dk and low Df with very high signal transmission density.; Sufficient flowability for thin wall design, improved ductility, dimensional and dielectric stability versus current solution.
Technical data
Table 1 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melt Volume Rate (at 190°C, 10.0 kg) ¹¹ | 7.5 | cm³/10 min | ISO 1133 |
| Melt Volume Rate (at 220°C, 10.0 kg) ¹¹ | 12.5 | cm³/10 min | ISO 1133 |
| Mold Shrinkage (flow) ᵍ ¹¹ | 1.5 - 2 | % | SABIC method |
| Density ¹¹ | 2.5 | g/cm³ | ISO 1183 |
| Water Absorption (at 23°C, 24hrs) ¹¹ | 0.08 | % | ISO 62-1 |
Table 2 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, 5 mm/min) ¹¹ | 20 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1.2 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 2550 | MPa | ISO 527 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 15 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 2750 | MPa | ISO 178 |
Table 3 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹ | 0.00013 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹ | 0.00015 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 100 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 60 | °C | ISO 75/Af |
Table 4 of 6
6 rows| Characteristic | Value | Method |
|---|---|---|
| Dissipation Factor (at 100 MHz) ¹¹ | 0.009 | IEC 60250 |
| Dissipation Factor (at 500 MHz) ¹¹ | 0.008 | IEC 60250 |
| Dissipation Factor (at at 1 GHz) ¹¹ | 0.008 | IEC 60250 |
| Relative Permittivity (1 GHz) ¹¹ | 13.1 | IEC 60250 |
| Relative Permittivity (100 MHz) ¹¹ | 13.6 | IEC 60250 |
| Relative Permittivity (500 MHz) ¹¹ | 13.4 | IEC 60250 |
Table 5 of 6
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 5.5 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 3.5 | kJ/m² | ISO 180/1A |
Table 6 of 6
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 80 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.03 | % |
| Melt Temperature ⁷ | 210 - 215 | °C |
| Front - Zone 3 Temperature ⁷ | 205 - 215 | °C |
| Middle - Zone 2 Temperature ⁷ | 200 - 210 | °C |
| Rear - Zone 1 Temperature ⁷ | 190 - 200 | °C |
| Mold Temperature ⁷ | 15 - 55 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
