LNP™ THERMOCOMP™ Compound DX10311X

Chemical Family: Polycarbonate (PC)

SABIC's Specialties Business LNP™ THERMOCOMP™ DX10311X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus and Good Ductility.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Lawn & Garden

Building & Construction — Decorative Materials & Finishes

Artificial Turf

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polycarbonates

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polycarbonate (PC)
Fillers Included: Glass Fiber
Flexural Modulus: 7410.0 - 7410.0 MPa
Additives Included: Heat Stabilizer, Impact Modifier, Mold Release Agent; Heat Stabilizer; Impact Modifier; Mold Release Agent
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Building & Construction
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Material Features: Cost Effective
Good Mold Release
Heat Stabilized
High Ductility
High Impact Resistance
High Modulus
High Stiffness
Impact Modified
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Building Materials
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Doors
Electrical Components
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

11 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	114	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	2.5	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	8690	MPa	ASTM D638
Flexural Stress ¹¹	180	MPa	ASTM D790
Flexural Modulus ¹¹	7410	MPa	ASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹	115	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2.50E+00	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	8610	MPa	ISO 527
Flexural Stress (Yield, at 2 mm/min) ¹¹	172	MPa	ISO 178
Flexural Stress (Break, 2 mm/min) ¹¹	180	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	7450	MPa	ISO 178

Table 2 of 5

4 rows

Characteristic	Value	Unit	Method
Specific Gravity ¹¹	1.43	—	ASTM D792
Mold Shrinkage (flow, 3.2 mm) ᵍ ¹¹	0.1 - 0.4	%	SABIC method
Mold Shrinkage (xflow, 3.2 mm) ᵍ ¹¹	0.2 - 0.5	%	SABIC method
Melt Volume Rate (at 300°C, 2.16 kg) ¹¹	9	cm³/10 min	ISO 1133

Table 3 of 5

3 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	125	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000021	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000068	1/°C	ASTM E831

Table 4 of 5