LNP™ THERMOCOMP™ Compound JF006LXZ

Chemical Family: Polysulfones

LNP THERMOCOMP JF006LXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Low Extractables.

Product families

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Devices & Assemblies

Consumer Electronics

Healthcare & Pharma — Medical

Medical Devices & Assemblies
Tubing & Fluids Handling

Electrical & Electronics — Parts & Components

Housings & Enclosures

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyethersulfone (PES)
Fillers Included: Glass Fiber
Flexural Modulus: 9230.0 - 9230.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Healthcare & Pharma
Technology: Plastics
Labeling Claims: Food Contact Acceptable
Material Features: Cost Effective
Food Contact Acceptable
High Modulus
High Stiffness
High Temperature Resistance
Low Extractables
Low Leachable
Very Good Heat Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Appliances
Commercial Appliance
Consumer Applications
Electrical Enclosure
Electrical Internal Frame
Home Appliances
Internal Armature
Medical/Healthcare Applications
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

10 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break) ¹¹	113	MPa	ASTM D638
Tensile Stress (Break) ¹¹	99	MPa	ISO 527
Tensile Strain (Break) ¹¹	1.4	%	ISO 527
Tensile Strain (Break) ¹¹	1.8	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	9790	MPa	ASTM D638
Flexural Stress ¹¹	172	MPa	ASTM D790
Flexural Stress ¹¹	222	MPa	ISO 178
Flexural Modulus ¹¹	9230	MPa	ASTM D790
Flexural Modulus ¹¹	9240	MPa	ISO 178
Tensile Modulus (at 1 mm/min) ¹¹	10190	MPa	ISO 527

Table 2 of 5

7 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.61	g/cm³	ASTM D792
Density ¹¹	1.6	g/cm³	ISO 1183
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.3	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.2	%	ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.25	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.7	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.69	%	ISO 294

Table 3 of 5

6 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	217	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	212	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000306	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000301	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000036	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.0000364	1/°C	ISO 11359-2

Table 4 of 5