LNP™ THERMOCOMP™ Compound 2F005

Name: LNP™ THERMOCOMP™ Compound 2F005
Brand: LNP™ THERMOCOMP™ Compound

LNP THERMOCOMP 2F005 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 25% glass fiber.

Product families

Industrial — Chemical & Industrial Manufacturing

Electrical & Electronics — Devices & Assemblies

Electrical & Electronics — Parts & Components

Industrial — Power, Water & Utilities

Plastics — Engineering & Specialty Polymers

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Ethylene Tetrafluoroethylene Copolymer (ETFE)
Fillers Included: Glass Fiber
Flexural Modulus: 5200.0 - 5200.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Electrical & Electronics
Industrial
Technology: Plastics
Material Features: Cost Effective
High Modulus
High Stiffness
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Electrical Enclosure
Electrical Internal Frame
Electrical/Electronic Applications
Energy Management
Industrial Applications
Internal Armature
Semiconductor Applications
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

13 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield, 5 mm/min) ¹¹	61	MPa	ISO 527
Tensile Stress (Break, 5 mm/min) ¹¹	60	MPa	ISO 527
Tensile Strain (Yield, 5 mm/min) ¹¹	6.6	%	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	7	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	5670	MPa	ISO 527
Flexural Stress ¹¹	87	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	5200	MPa	ISO 178
Tensile Stress (Yield, Type I, 5 mm/min) ¹¹	61	MPa	ASTM D638
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	59	MPa	ASTM D638
Tensile Strain (Yield, Type I, 5 mm/min) ¹¹	7	%	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	8.1	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	6190	MPa	ASTM D638

6 rows

Characteristic	Value	Unit	Method
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.02	%	ISO 62
Specific Gravity ¹¹	1.87	—	ASTM D792
Density ¹¹	1.87	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.01	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	1 - 3	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	2 - 4	%	ASTM D955

6 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	232	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	132	°C	ISO 75/Af
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	248	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	190	°C	ASTM D648
Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹	0.000061	1/°C	ASTM D696
Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹	0.000064	1/°C	ASTM D696

6 rows

Characteristic	Value	Unit	Method
Izod Impact (Notched, 80104, at 23°C) ¹¹	44	kJ/m²	ISO 180/1A
Izod Impact (Unnotched, 80104, at 23°C) ¹¹	90	kJ/m²	ISO 180/1U
Multi-Axial Impact ¹¹	10	J	ISO 6603
Izod Impact (Notched, at 23°C) ¹¹	529	J/m	ASTM D256
Izod Impact (Unnotched, at 23°C) ¹¹	1600	J/m	ASTM D4812
Instrumented Dart Impact Total Energy (at 23°C) ¹¹	21	J	ASTM D3763

9 rows