LNP™ THERMOCOMP™ Compound LF003

Name: LNP™ THERMOCOMP™ Compound LF003
Brand: LNP™ THERMOCOMP™ Compound

LNP THERMOCOMP LF003 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber.

Product families

Industrial — Chemical & Industrial Manufacturing

Electrical & Electronics — Devices & Assemblies

Electrical & Electronics — Parts & Components

Plastics — Engineering & Specialty Polymers

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyetheretherketone (PEEK)
Fillers Included: Glass Fiber
Flexural Modulus: 6274.0 - 6274.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Industrial
Technology: Plastics
Material Features: Cost Effective
High Modulus
High Stiffness
High Temperature Resistance
Very Good Heat Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Appliances
Cell Phones
Commercial Appliance
Computer Components
Consumer Applications
Displays
Electrical Components
Electrical Enclosure
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

14 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield) ¹¹	125	MPa	ISO 527
Tensile Stress (Yield) ¹¹	136	MPa	ASTM D638
Tensile Stress (Break) ¹¹	136	MPa	ASTM D638
Tensile Stress (Break) ¹¹	125	MPa	ISO 527
Tensile Strain (Yield) ¹¹	2.9	%	ASTM D638
Tensile Strain (Yield) ¹¹	2.3	%	ISO 527
Tensile Strain (Break) ¹¹	3.1	%	ASTM D638
Tensile Strain (Break) ¹¹	2.3	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	6930	MPa	ISO 527
Flexural Stress ¹¹	199	MPa	ASTM D790
Flexural Stress ¹¹	209	MPa	ISO 178
Flexural Modulus ¹¹	7000	MPa	ISO 178

6 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.39	g/cm³	ISO 1183
Density ¹¹	1.39	g/cm³	ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.8	%	ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.79	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	1	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	1	%	ISO 294

8 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	325	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	244	°C	ISO 75/Af
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000306	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000031	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.0000486	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000048	1/°C	ISO 11359-2
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	328	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	258	°C	ASTM D648

6 rows

Characteristic	Value	Unit	Method
Izod Impact (Notched, 80104, at 23°C) ¹¹	6	kJ/m²	ISO 180/1A
Izod Impact (Unnotched, 80104, at 23°C) ¹¹	54	kJ/m²	ISO 180/1U
Multi-Axial Impact ¹¹	3	J	ISO 6603
Izod Impact (Notched, at 23°C) ¹¹	53	J/m	ASTM D256
Izod Impact (Unnotched, at 23°C) ¹¹	854	J/m	ASTM D4812
Instrumented Dart Impact Energy (Peak, at 23°C) ¹¹	14	J	ASTM D3763

8 rows