LNP™ THERMOCOMP™ Compound LF002
- Chemical Family
- Polyether Ether Ketone (PEEK)
SABIC's Specialties Business LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Displays
- Industrial Automation
- Connectors
- Housings & Enclosures
- Semiconductor Manufacturing
- Switches & Relays
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyetheretherketone (PEEK)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 5660.0 - 5660.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- High Modulus
- High Stiffness
- High Temperature Resistance
- No Added PFAS
- Very Good Heat Resistance
- Country Availability
- Canada
- Mexico
- USA
- Plastics and Elastomers End Uses
- Appliances
- Cell Phones
- Commercial Appliance
- Computer Components
- Displays
- Electrical Components
- Electrical Enclosure
- Electrical Internal Frame
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
17 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, 5 mm/min) ¹¹ | 125 | MPa | ISO 527 |
| Tensile Stress (Yield, 5 mm/min) ¹¹ | 97 | MPa | ISO 527 |
| Tensile Stress (Yield, Type I, 5 mm/min) ¹¹ | 120 | MPa | ASTM D638 |
| Tensile Strain (Yield, 5 mm/min) ¹¹ | 3.4 | % | ISO 527 |
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 114 | MPa | ASTM D638 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 5700 | MPa | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 6490 | MPa | ISO 527 |
| Tensile Strain (Yield, Type I, 5 mm/min) ¹¹ | 3.3 | % | ASTM D638 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 162 | MPa | ISO 178 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 4.2 | % | ASTM D638 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 4700 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 5660 | MPa | ISO 178 |
Table 2 of 5
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.37 | g/cm³ | ISO 1183 |
| Density ¹¹ | 1.37 | g/cm³ | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.07 | % | ASTM D570 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.3 - 0.6 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.5 - 0.8 | % | ASTM D955 |
| Moisture Absorption (at 23°C, 50% RH) ¹¹ | 0.12 | % | ISO 62 |
Table 3 of 5
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹ | 0.000035 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹ | 0.00005 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 159 | °C | ISO 75/Af |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 171 | °C | ISO 75/Af |
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 326 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 169 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹ | 0.000035 | 1/°C | ASTM D696 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹ | 0.000044 | 1/°C | ASTM D696 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 285 | °C | ISO 75/Bf |
Table 4 of 5
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 49 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 4 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 6 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 860 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 58 | J/m | ASTM D256 |
| Multi-Axial Impact ¹¹ | 2 | J | ISO 6603 |
| Instrumented Dart Impact Total Energy (at 23°C) ¹¹ | 8 | J | ASTM D3763 |
Table 5 of 5
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 150 | °C |
| Drying Temperature ⁷ | 120 - 150 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Front - Zone 3 Temperature ⁷ | 380 - 400 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 395 | °C |
| Maximum Moisture Content ⁷ | 0.1 | % |
| Melt Temperature ⁷ | 380 - 390 | °C |
| Middle - Zone 2 Temperature ⁷ | 380 - 400 | °C |
| Middle - Zone 2 Temperature ⁷ | 365 - 375 | °C |
| Rear - Zone 1 Temperature ⁷ | 370 - 380 | °C |
| Rear - Zone 1 Temperature ⁷ | 350 - 360 | °C |
