LNP™ THERMOCOMP™ Compound LC004XXP
- Chemical Family
- Polyether Ether Ketone (PEEK)
SABIC's Specialties Business LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Displays
- Industrial Automation
- Connectors
- Housings & Enclosures
- Semiconductor Manufacturing
- Switches & Relays
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyetheretherketone (PEEK)
- Fillers Included
- Carbon Fiber
- Flexural Modulus
- 13900.0 - 13900.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- ESD Protection
- Electrically Conductive
- High Stiffness
- High Strength
- Light Weight
- No Added PFAS
- Very Good Heat Resistance
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- ATEX Directives
- Plastics and Elastomers End Uses
- Cell Phones
- Computer Components
- Displays
- Electrical Components
- Electrical Enclosure
- Electrical Internal Frame
- Electrical/Electronic Applications
- Internal Armature
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, 5 mm/min) ¹¹ | 199 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1.9 | % | ISO 527 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 280 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 13900 | MPa | ISO 178 |
Table 2 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.1 - 0.3 | % | SABIC method |
| Density ¹¹ | 1.36 | g/cm³ | ISO 1183 |
Table 3 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity ¹¹ | 100 - 10000 | Ω | ASTM D257 |
Table 4 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 45 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 10 | kJ/m² | ISO 180/1A |
Table 5 of 5
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 - 150 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.1 | % |
| Melt Temperature ⁷ | 380 - 390 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 395 | °C |
| Middle - Zone 2 Temperature ⁷ | 365 - 375 | °C |
| Rear - Zone 1 Temperature ⁷ | 350 - 360 | °C |
| Mold Temperature ⁷ | 140 - 165 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed ⁷ | 60 - 100 | rpm |
