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LNP™ THERMOCOMP™ Compound RB00A

Chemical Family
Polyamides

LNP THERMOCOMP RB00A compound is based on Nylon 6/6 resin containing 50% glass bead.

Product families

Applications

Electrical & Electronics — Parts & Components
  • Connectors
  • Housings & Enclosures
  • Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
LNP™ THERMOCOMP™ Compound
Polymer Name
Polyamide 66 (PA 66)
Fillers Included
  • Glass Bead, Glass Fiber
  • Glass Bead
  • Glass Fiber
Flexural Modulus
6000.0 - 6000.0 MPa
Additives Included
  • Heat Stabilizer, Mold Release Agent
  • Heat Stabilizer
  • Mold Release Agent
Processing Methods
Injection Molding
Note

ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

Markets
Electrical & Electronics
Flame Rating
UL 94 HB
Technology
Plastics
Material Features
  • Cost Effective
  • Dimensional Stability
  • Good Mold Release
  • Heat Stabilized
  • High Stiffness
  • Low Warpage
Country Availability
  • Canada
  • China (Mainland)
  • Mexico
  • USA
Certifications and Compliance
UL 94
Plastics and Elastomers End Uses
  • Electrical Components
  • Electrical Enclosure
  • Electrical Internal Frame
  • Electrical/Electronic Applications
  • Electronic Components
  • Internal Armature
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 7

5 rows
CharacteristicValueUnitMethod
Tensile Stress (Break, 5 mm/min) ¹¹85MPaISO 527
Tensile Strain (Break, 5 mm/min) ¹¹2.5%ISO 527
Tensile Modulus (at 1 mm/min) ¹¹6200MPaISO 527
Flexural Stress (Break, 2 mm/min) ¹¹140MPaISO 178
Flexural Modulus (at 2 mm/min) ¹¹6000MPaISO 178

Table 2 of 7

3 rows
CharacteristicValueUnitMethod
Mold Shrinkage (on Tensile Bar, flow) ᵍ ¹¹0.5 - 0.8%SABIC method
Density ¹¹1.56g/cm³ISO 1183
Water Absorption (at 23°C, saturated) ¹¹4.5%ISO 62-1

Table 3 of 7

5 rows
CharacteristicValueUnitMethod
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹0.000031/°CISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹0.000031/°CISO 11359-2
Vicat Softening Temperature (Rate A/50) ¹¹255°CISO 306
Heat Deflection Temperature/Be (at 0.45MPa, Edgew 120*10*4, sp=100mm) ¹¹245°CISO 75/Be
Heat Deflection Temperature/Ae (at 1.8 Mpa, Edgew 120*10*4, sp=100mm) ¹¹175°CISO 75/Ae

Table 4 of 7

2 rows
CharacteristicValueUnitMethod
Comparative Tracking Index ¹¹500VIEC 60112
Comparative Tracking Index (M) ¹¹400VIEC 60112

Table 5 of 7

4 rows
CharacteristicValueUnitMethod
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹5kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*4, at -20°C) ¹¹4kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*4, at -40°C) ¹¹3kJ/m²ISO 180/1A
Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹30kJ/m²ISO 179/1eU

Table 6 of 7

10 rows
CharacteristicValueUnit
Drying Temperature ⁷75 - 85°C
Drying Time ⁷4 - 6Hrs
Maximum Moisture Content ⁷0.2%
Melt Temperature ⁷260 - 290°C
Nozzle Temperature ⁷250 - 270°C
Front - Zone 3 Temperature ⁷260 - 280°C
Middle - Zone 2 Temperature ⁷260 - 280°C
Rear - Zone 1 Temperature ⁷270 - 290°C
Hopper Temperature ⁷60 - 80°C
Mold Temperature ⁷70 - 120°C

Table 7 of 7

1 row
CharacteristicValueUnitMethod
UL Compliant (94HB Flame Class Rating)1.6mmUL 94 by SABIC-IP

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