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LNP™ THERMOCOMP™ Compound LF004E

SABIC's Specialties Business LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Displays
  • Industrial Automation
Electrical & Electronics — Parts & Components
  • Connectors
  • Housings & Enclosures
  • Semiconductor Manufacturing
  • Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers
  • High Performance Thermoplastics

Other characteristics

Brand
LNP™ THERMOCOMP™ Compound
Polymer Name
Polyetheretherketone (PEEK)
Fillers Included
Glass Fiber
Flexural Modulus
7720.0 - 7720.0 MPa
Processing Methods
Injection Molding
Note

ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

Markets
  • Consumer Goods
  • Electrical & Electronics
Technology
Plastics
Labeling Claims
No Added PFAS
Material Features
  • Cost Effective
  • Easy To Mold
  • Good Moldability
  • Good Processability
  • High Modulus
  • High Stiffness
  • High Temperature Resistance
  • No Added PFAS
Country Availability
  • Canada
  • China (Mainland)
  • Mexico
  • USA
Plastics and Elastomers End Uses
  • Appliances
  • Cell Phones
  • Commercial Appliance
  • Computer Components
  • Displays
  • Electrical Components
  • Electrical Enclosure
  • Electrical Internal Frame
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 5

27 rows
CharacteristicValueUnitMethod
Tensile Stress (Break, 5 mm/min) ¹¹124MPaISO 527
Tensile Stress (Break, Type I, 5 mm/min) ¹¹147MPaASTM D638
Tensile Stress (Yield) ¹¹114MPaISO 527
Tensile Stress (Yield) ¹¹126MPaASTM D638
Tensile Strain (Break, 5 mm/min) ¹¹1.7%ISO 527
Tensile Strain (Break, Type I, 5 mm/min) ¹¹2.3%ASTM D638
Tensile Stress (Break) ¹¹114MPaISO 527
Tensile Stress (Break) ¹¹126MPaASTM D638
Tensile Modulus (at 1 mm/min) ¹¹8500MPaISO 527
Tensile Modulus (at 1 mm/min) ¹¹8620MPaISO 527
Tensile Modulus (at 1 mm/min) ¹¹7630MPaISO 527
Tensile Modulus (at 5 mm/min) ¹¹8730MPaASTM D638

Table 2 of 5

12 rows
CharacteristicValueUnitMethod
Density ¹¹1.42g/cm³ASTM D792
Density ¹¹1.42g/cm³ISO 1183
Density ¹¹1.43g/cm³ASTM D792
Specific Gravity ¹¹1.45—ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹0.09%ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.3 - 0.5%ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.44%ISO 294
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.71%ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹0.5 - 0.7%ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹1.2%ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹0.58%ISO 294
Moisture Absorption (at 23°C, 50% RH) ¹¹0.1%ISO 62

Table 3 of 5

13 rows
CharacteristicValueUnitMethod
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹min. 280°CISO 75/Af
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹305°CISO 75/Af
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹261°CISO 75/Af
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹335°CASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹320°CASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹286°CASTM D648
Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹0.0000281/°CASTM D696
Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹0.0000451/°CASTM D696
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹332°CISO 75/Bf
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹0.0000331/°CISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹0.00003421/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹0.0000451/°CASTM E831

Table 4 of 5

9 rows
CharacteristicValueUnitMethod
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹25kJ/m²ISO 180/1U
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹30kJ/m²ISO 180/1U
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹4kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹6kJ/m²ISO 180/1A
Izod Impact (Unnotched, at 23°C) ¹¹505J/mASTM D4812
Izod Impact (Notched, at 23°C) ¹¹42J/mASTM D256
Multi-Axial Impact ¹¹1JISO 6603
Instrumented Dart Impact Total Energy (at 23°C) ¹¹6JASTM D3763
Instrumented Dart Impact Energy (Peak, at 23°C) ¹¹8JASTM D3763

Table 5 of 5

16 rows
CharacteristicValueUnit
Drying Temperature ⁷150°C
Drying Temperature ⁷120 - 150°C
Drying Time ⁷4Hrs
Drying Time ⁷4 - 6Hrs
Front - Zone 3 Temperature ⁷380 - 400°C
Front - Zone 3 Temperature ⁷380 - 395°C
Maximum Moisture Content ⁷0.1%
Melt Temperature ⁷380 - 390°C
Middle - Zone 2 Temperature ⁷380 - 400°C
Middle - Zone 2 Temperature ⁷365 - 375°C
Rear - Zone 1 Temperature ⁷370 - 380°C
Rear - Zone 1 Temperature ⁷350 - 360°C

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