LNP™ THERMOCOMP™ Compound KF004

Name: LNP™ THERMOCOMP™ Compound KF004
Brand: LNP™ THERMOCOMP™ Compound

SABIC's Specialties Business LNP THERMOCOMP KF004 compound is based on POM (Acetal) copolymer resin containing 20% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Sports & Recreation

Building & Construction — Building Envelope & Roofing

Glazing & Window Elements

Building & Construction — Building Materials

Interior Fixtures

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polyacetals

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyacetal Copolymer (POM)
Fillers Included: Glass Fiber
Flexural Modulus: 8200.0 - 8200.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Building & Construction
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
High Modulus
High Stiffness
No Added PFAS
Country Availability: Canada
Mexico
USA
Plastics and Elastomers End Uses: Building Materials
Cell Phones
Computer Components
Construction Applications
Consumer Applications
Containers
Displays
Electrical Components
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

9 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, 5 mm/min) ¹¹	104	MPa	ISO 527
Tensile Stress (Break) ¹¹	108	MPa	ASTM D638
Tensile Strain (Break) ¹¹	2.3	%	ASTM D638
Tensile Strain (Yield, 5 mm/min) ¹¹	2.3	%	ISO 527
Flexural Stress ¹¹	186	MPa	ASTM D790
Tensile Modulus (at 1 mm/min) ¹¹	7200	MPa	ISO 527
Flexural Modulus ¹¹	8200	MPa	ASTM D790
Flexural Stress (Yield, at 2 mm/min) ¹¹	122	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	5500	MPa	ISO 178

Table 2 of 5

3 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.54	g/cm³	ISO 1183
Density ¹¹	1.56	g/cm³	ASTM D792
Mold Shrinkage (flow) ᵍ ¹¹	0.5	%	SABIC method

Table 3 of 5

4 rows

Characteristic	Value	Unit	Method
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹	0.000063	1/°C	ISO 11359-2
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	162	°C	ASTM D648
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹	0.000107	1/°C	ISO 11359-2
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	157	°C	ISO 75/Af

Table 4 of 5