LNP™ THERMOCOMP™ Compound DX15354

Chemical Family: Polycarbonate (PC)

SABIC's Specialties Business LNP THERMOCOMP DX15354 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Heat Resistance. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Interior

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics
Polycarbonates

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polycarbonate (PC)
Fillers Included: Talc
Flexural Modulus: 2880.0 - 2880.0 MPa
Additives Included: Heat Stabilizer, Metal Deactivator, Mold Release Agent, UV Stabilizer; Heat Stabilizer; Metal Deactivator; Mold Release Agent; UV Stabilizer
Processing Methods: Injection Molding, Laser Sintering (SLS)
Note: ⁷ Параметры литья под давлением упоминаются только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных деталей и газовое литье.. ¹¹ Информация, указанная в технических паспортах, должна использоваться только в качестве ориентировочной для целей выбора материала и не должна использоваться в качестве спецификации или для проектирования деталей или пресс-форм.
Markets: Automotive & Transportation
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
Excellent Dielectric Properties
Good Mold Release
Heat Stabilized
High Impact Resistance
High Temperature Resistance
No Added PFAS
UV Stabilized
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Automotive Interior Parts
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Electrical Components
Electrical Enclosure
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding
Laser Sintering (SLS)

Technical data

Table 1 of 6

10 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	59	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	11	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	2920	MPa	ASTM D638
Flexural Strength (at 1.3 mm/min, 50 mm span) ¹¹	111	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	2890	MPa	ASTM D790
Tensile Stress (Break, 50 mm/min) ¹¹	58	MPa	ISO 527
Tensile Strain (Break, 50 mm/min) ¹¹	11	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	2940	MPa	ISO 527
Flexural Strength (at 2 mm/min) ¹¹	112	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	2880	MPa	ISO 178

Table 2 of 6

3 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.29	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.13	%	ISO 62
Melt Volume Rate (at 330°C, 1.2 kg) ¹¹	22.8	cm³/10 min	ISO 1133

Table 3 of 6

4 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	168	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	155	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000063	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000067	1/°C	ASTM E831

Table 4 of 6

2 rows

Characteristic	Value	Method
Dielectric Constant (at 1.1 GHz) ¹¹	2.95	SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹	0.006	SABIC method

Table 5 of 6