To catalogue

LNP™ THERMOCOMP™ Compound LC00AEX1

SABIC's Specialties Business LNP™ THERMOCOMP™ LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Displays
  • Industrial Automation
Electrical & Electronics — Parts & Components
  • Connectors
  • Housings & Enclosures
  • Semiconductor Manufacturing
  • Switches & Relays
Automotive & Transportation — Transportation
  • Aerospace & Aviation

Product Families

Plastics — Engineering & Specialty Polymers
  • High Performance Thermoplastics

Other characteristics

Brand
LNP™ THERMOCOMP™ Compound
Polymer Name
Polyetheretherketone (PEEK)
Fillers Included
Carbon Fiber
Flexural Modulus
39100.0 - 39100.0 MPa
Additives Included
Mold Release Agent
Processing Methods
Injection Molding
Note

ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

Markets
  • Automotive & Transportation
  • Consumer Goods
  • Electrical & Electronics
  • Industrial
Technology
Plastics
Material Features
  • Cost Effective
  • Dimensional Stability
  • Easy To Mold
  • Electrically Conductive
  • Good Mold Release
  • Good Moldability
  • Good Processability
  • High Modulus
Country Availability
  • Canada
  • China (Mainland)
  • Mexico
  • USA
Plastics and Elastomers End Uses
  • Air Cabin Interior
  • Cell Phones
  • Computer Components
  • Displays
  • Electrical Components
  • Electrical Enclosure
  • Electrical Internal Frame
  • Electrical/Electronic Applications
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 6

10 rows
CharacteristicValueUnitMethod
Flexural Strength (at 1.3 mm/min, 50 mm span) ¹¹383MPaASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹37000MPaASTM D790
Tensile Stress (Break, Type I, 5 mm/min) ¹¹251MPaASTM D638
Tensile Modulus (at 5 mm/min) ¹¹44000MPaASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹1.3%ASTM D638
Flexural Strength (at 2 mm/min) ¹¹404MPaISO 178
Flexural Modulus (at 2 mm/min) ¹¹39100MPaISO 178
Tensile Stress (Break, 5 mm/min) ¹¹270MPaISO 527
Tensile Modulus (at 1 mm/min) ¹¹44000MPaISO 527
Tensile Strain (Break, 5 mm/min) ¹¹1.4%ISO 527

Table 2 of 6

5 rows
CharacteristicValueUnitMethod
Specific Gravity ¹¹1.5—ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.1 - 0.2%ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹0.2 - 0.3%ASTM D955
Density ¹¹1.5g/cm³ASTM D792
Moisture Absorption (at 23°C, 50% RH) ¹¹0.01%ISO 62

Table 3 of 6

6 rows
CharacteristicValueUnitMethod
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹329°CASTM D648
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹338°CASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹330°CISO 75/Af
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹337°CISO 75/Bf
Coefficient of Thermal Expansion (at -40°C to 120°C, flow) ¹¹0.00000171/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 120°C, xflow) ¹¹0.0000481/°CASTM E831

Table 4 of 6

2 rows
CharacteristicValueUnitMethod
Surface Resistivity ¹¹1000000ΩASTM D257
Volume Resistivity ¹¹1000000Ω.cmASTM D257

Table 5 of 6

6 rows
CharacteristicValueUnitMethod
Izod Impact (Notched, at 23°C) ¹¹68.1J/mASTM D256
Izod Impact (Unnotched, at 23°C) ¹¹503J/mASTM D4812
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹7.7kJ/m²ISO 180/1A
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹42.9kJ/m²ISO 180/1U
Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹6.7kJ/m²ISO 179/1eA
Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹52kJ/m²ISO 179/1eU

Table 6 of 6

9 rows
CharacteristicValueUnit
Drying Temperature ⁷120 - 150°C
Drying Time ⁷3 - 5Hrs
Nozzle Temperature ⁷380 - 400°C
Melt Temperature ⁷380 - 400°C
Front - Zone 3 Temperature ⁷370 - 380°C
Middle - Zone 2 Temperature ⁷360 - 370°C
Rear - Zone 1 Temperature ⁷290 - 300°C
Mold Temperature ⁷170 - 200°C
Screw Speed ⁷50 - 100rpm

The Omnichem website uses cookies. By continuing to use the site, you consent to their use in accordance with our Privacy Policy and to the collection of analytics.