LNP™ THERMOCOMP™ Compound EC004APQ
- Chemical Family
- Polyetherimide (PEI)Polyimides (PI)
SABIC's Specialties Business LNP THERMOCOMP EC004APQ compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyether Imide (PEI)
- Fillers Included
- Carbon Fiber
- Additives Included
- Flame Retardant
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Automotive & Transportation
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Quality Standards
- FAR 25.853
- Material Features
- Cost Effective
- ESD Protection
- Electrically Conductive
- Flame Retardant
- Good Moldability
- Good Processability
- High Modulus
- High Stiffness
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- OSU Compliance
Technical data
Table 1 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.2 - 0.4 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.4 - 0.7 | % | ASTM D955 |
| Specific Gravity ¹¹ | 1.33 | — | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.15 | % | ASTM D570 |
| Poisson's Ratio ¹¹ | 0.44 | — | ASTM E132 |
Table 2 of 6
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Shear Modulus ¹¹ | 4399 | MPa | ASTM D732 |
| Shear Strength ¹¹ | 121.35 | MPa | ASTM D732 |
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 245 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 2.3 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 19140 | MPa | ASTM D638 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 344 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 15800 | MPa | ASTM D790 |
Table 3 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.0000054 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000055 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 170 | °C | ASTM D648 |
Table 4 of 6
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity ¹¹ | 100000 - 1000000 | Ω | ASTM D257 |
Table 5 of 6
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 711 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 109 | J/m | ASTM D256 |
Table 6 of 6
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 150 | °C |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 360 - 400 | °C |
| Rear - Zone 1 Temperature ⁷ | 360 - 380 | °C |
| Middle - Zone 2 Temperature ⁷ | 370 - 390 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 400 | °C |
| Nozzle Temperature ⁷ | 390 - 400 | °C |
| Mold Temperature ⁷ | 140 - 180 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed (Circumferential speed) ⁷ | 0.2 - 0.3 | m/s |
| Vent Depth ⁷ | 0.025 - 0.076 | mm |
