LNP™ THERMOCOMP™ Compound DX10311
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP THERMOCOMP DX10311 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus and Good Ductility. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polycarbonates
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 7670.0 - 7670.0 MPa
- Additives Included
Heat Stabilizer, Impact Modifier, Mold Release Agent; Heat Stabilizer; Impact Modifier; Mold Release Agent
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- Good Mold Release
- Heat Stabilized
- High Ductility
- High Impact Resistance
- High Modulus
- High Stiffness
- Impact Modified
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Potential Applications
PC based LNP THERMOCOMP™ compounds may be qualified to use in consumer electronics, industrial applications for combination of dimensional stability, thin wall and non-Br/Cl Eco FR systems.
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Building Materials
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Doors
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
11 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 117 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 2.6 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 8330 | MPa | ASTM D638 |
| Flexural Stress ¹¹ | 190 | MPa | ASTM D790 |
| Flexural Modulus ¹¹ | 7670 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 119 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 2.7 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 8260 | MPa | ISO 527 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 182 | MPa | ISO 178 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 181 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 7720 | MPa | ISO 178 |
Table 2 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.42 | — | ASTM D792 |
| Mold Shrinkage (flow, 3.2 mm) ᵍ ¹¹ | 0.1 - 0.3 | % | SABIC method |
| Mold Shrinkage (xflow, 3.2 mm) ᵍ ¹¹ | 0.2 - 0.4 | % | SABIC method |
| Melt Volume Rate (at 300°C, 5.0 kg) ¹¹ | 37 | cm³/10 min | ISO 1133 |
Table 3 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 128 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000019 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000064 | 1/°C | ASTM E831 |
| Relative Temperature Index (Electrical) ᵖ ¹¹ | 80 | °C | UL 746B |
| Relative Temperature Index (Mechanical with impact) ᵖ ¹¹ | 80 | °C | UL 746B |
| Relative Temperature Index (Mechanical without impact) ᵖ ¹¹ | 80 | °C | UL 746B |
Table 4 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Charpy Impact (Unnotched, at 23°C) ¹¹ | 57 | kJ/m² | ISO 179/2C |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 752 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 196 | J/m | ASTM D256 |
| Charpy Impact (Notched, at 23°C) ¹¹ | 20 | kJ/m² | ISO 179/2C |
Table 5 of 6
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 90 - 110 | °C |
| Drying Time ⁷ | 3 - 5 | Hrs |
| Melt Temperature ⁷ | 280 - 320 | °C |
| Nozzle Temperature ⁷ | 280 - 320 | °C |
| Front - Zone 3 Temperature ⁷ | 280 - 320 | °C |
| Middle - Zone 2 Temperature ⁷ | 280 - 320 | °C |
| Rear - Zone 1 Temperature ⁷ | 250 - 280 | °C |
| Mold Temperature ⁷ | 90 - 120 | °C |
| Back Pressure ⁷ | 1 - 5 | MPa |
| Screw Speed ⁷ | 30 - 100 | rpm |
Table 6 of 6
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94HB Flame Class Rating) ᵖ | min. 1 | mm | UL 94 |
