LNP™ THERMOCOMP™ Compound 5C004
- Chemical Family
- Vinyls Vinylics & Vinyl Derivatives
LNP™ THERMOCOMP™ Compound 5C004 is a Polyvinylidene fluoride (PVDF) resin-based compound infused with 20% carbon fiber, imparting excellent electrical conductivity. This grade offers remarkable stiffness and strength characteristics, making it well-suited for applications in electrical and electronics, energy management, electronic components, and industrial material handling. The compound is processed using injection molding techniques.
Product families
Applications
- Industrial Automation
- Housings & Enclosures
- Semiconductor Manufacturing
- Renewable Energy
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyvinylidene Fluoride (PVDF)
- Fillers Included
- Carbon Fiber
- Flexural Modulus
- 13930.0 - 13930.0 MPa
- Processing Methods
- Injection Molding
- Note
⁷ Параметры литья под давлением указаны только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных деталей и газовое литье.. ¹¹ Информация, указанная в технических паспортах, должна использоваться только для целей выбора материала и не должна использоваться в качестве спецификации или для проектирования деталей или пресс-форм.
- Markets
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Material Features
- Cost Effective
- ESD Protection
- Electrically Conductive
- High Stiffness
- High Strength
- Light Weight
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Electrical Enclosure
- Electrical Internal Frame
- Electrical/Electronic Applications
- Energy Management
- Internal Armature
- Semiconductor Applications
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break) ¹¹ | 84 | MPa | ASTM D638 |
| Tensile Strain (Break) ¹¹ | 0.7 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 16440 | MPa | ASTM D638 |
| Flexural Stress ¹¹ | 137 | MPa | ASTM D790 |
| Flexural Modulus ¹¹ | 13930 | MPa | ASTM D790 |
Table 2 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.75 | g/cm³ | ASTM D792 |
Table 3 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 153 | °C | ASTM D648 |
Table 4 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 285 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 53 | J/m | ASTM D256 |
Table 5 of 5
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 - 150 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Melt Temperature ⁷ | 215 - 230 | °C |
| Front - Zone 3 Temperature ⁷ | 225 - 245 | °C |
| Middle - Zone 2 Temperature ⁷ | 210 - 225 | °C |
| Rear - Zone 1 Temperature ⁷ | 190 - 210 | °C |
| Mold Temperature ⁷ | 65 - 90 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
