LNP™ THERMOCOMP™ Compound EC006AQW

Chemical Family: Polyetherimide (PEI)Polyimides (PI)

SABIC's Specialties Business LNP™ THERMOCOMP™ EC006AQW compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This grade has been pre-assessed and passed the material related tests from the ISO 10993 “Biological Evaluation of Medical Devices”.

Product families

Applications

Healthcare & Pharma — Medical

Medical Devices & Assemblies
Surgical Instruments & Trays
Tubing & Fluids Handling

Printing & Packaging — Packaging

Healthcare Packaging
Industrial & Transport Packaging

Electrical & Electronics — Parts & Components

Housings & Enclosures

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyether Imide (PEI)
Fillers Included: Carbon Fiber
Flexural Modulus: 23280.0 - 23280.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Electrical & Electronics
Healthcare & Pharma
Printing & Packaging
Technology: Plastics
Labeling Claims: Biocompatible
Material Features: Biocompatible
Cost Effective
ESD Protection
Electrically Conductive
Good Moldability
High Modulus
High Stiffness
High Strength
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Electrical Enclosure
Electrical Internal Frame
Fluid Handling
Internal Armature
Medical Devices
Medical Packaging
Medical/Healthcare Applications
Pharmaceutical Packaging
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

11 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	255	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	1.4	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	29220	MPa	ASTM D638
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	351	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	22200	MPa	ASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹	257	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	1.4	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	27540	MPa	ISO 527
Flexural Strength (at 2 mm/min) ¹¹	350	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	23280	MPa	ISO 178
Compressive Strength ¹¹	234	MPa	SABIC method

Table 2 of 5

4 rows

Characteristic	Value	Unit	Method
Specific Gravity ¹¹	1.39	—	ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.1 - 0.3	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.1 - 0.6	%	ASTM D955
Melt Flow Rate (at 380°C, 6.7 kgf) ¹¹	10	g/10 min	ASTM D1238

Table 3 of 5

2 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	198	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	198	°C	ISO 75/Af

Table 4 of 5