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LNP™ THERMOCOMP™ Compound DX11354X

Chemical Family
Polycarbonate (PC)

SABIC's Specialties Business LNP THERMOCOMP DX11354X compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Impact, Colorable. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Automotive & Transportation — Automotive
  • Interior
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Displays
Printing & Packaging — Packaging
  • Non-Food Consumer Packaging
Personal Care — Packaging & Accessories
  • Applicators & Accessories
Electrical & Electronics — Parts & Components
  • Connectors
  • Housings & Enclosures
  • Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers
  • Polycarbonates

Other characteristics

Brand
LNP™ THERMOCOMP™ Compound
Polymer Name
Polycarbonate (PC)
Fillers Included
  • Silicone Oil, Talc
  • Silicone Oil
  • Talc
Flexural Modulus
2450.0 - 2450.0 MPa
Additives Included

Heat Stabilizer, Metal Deactivator, Mold Release Agent; Heat Stabilizer; Metal Deactivator; Mold Release Agent

Processing Methods
Injection Molding, Laser Sintering (SLS)
Note

ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

Color
White
Markets
  • Automotive & Transportation
  • Consumer Goods
  • Electrical & Electronics
  • Personal Care
  • Printing & Packaging
Flame Rating
UL 94 HB
Technology
Plastics
Labeling Claims
No Added PFAS
Material Features
  • Cost Effective
  • Excellent Dielectric Properties
  • Good Colorability
  • Good Mold Release
  • Heat Stabilized
  • High Ductility
  • High Impact Resistance
  • No Added PFAS
Country Availability
  • Canada
  • China (Mainland)
  • Mexico
  • USA
Certifications and Compliance
UL 94
Plastics and Elastomers End Uses
  • Automotive Interior Parts
  • Cell Phones
  • Computer Components
  • Consumer Applications
  • Containers
  • Displays
  • Electrical Components
  • Electrical Enclosure
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
  • Injection Molding
  • Laser Sintering (SLS)

Technical data

Table 1 of 7

14 rows
CharacteristicValueUnitMethod
Tensile Stress (Yield, Type I, 50 mm/min) ¹¹55MPaASTM D638
Tensile Stress (Break, Type I, 50 mm/min) ¹¹45MPaASTM D638
Tensile Strain (Yield, Type I, 50 mm/min) ¹¹5%ASTM D638
Tensile Strain (Break, Type I, 50 mm/min) ¹¹70%ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹2400MPaASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹86MPaASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹2380MPaASTM D790
Tensile Stress (Yield, 50 mm/min) ¹¹54MPaISO 527
Tensile Stress (Break, 50 mm/min) ¹¹51MPaISO 527
Tensile Strain (Yield, 50 mm/min) ¹¹5%ISO 527
Tensile Strain (Break, 50 mm/min) ¹¹84%ISO 527
Tensile Modulus (at 1 mm/min) ¹¹2320MPaISO 527

Table 2 of 7

5 rows
CharacteristicValueUnitMethod
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.5 - 0.7%ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹0.5 - 0.7%ISO 294
Density ¹¹1.28g/cm³ISO 1183
Moisture Absorption (at 23°C, 50% RH) ¹¹0.05%ISO 62
Melt Volume Rate (at 300°C, 1.2 kg) ¹¹20cm³/10 minISO 1133

Table 3 of 7

9 rows
CharacteristicValueUnitMethod
Vicat Softening Temperature (Rate A/50) ¹¹136°CASTM D1525
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹121°CASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹0.0000651/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹0.0000711/°CASTM E831
Vicat Softening Temperature (Rate B/50) ¹¹136°CISO 306
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹117°CISO 75/Af
Relative Temperature Index (Electrical) ᵖ ¹¹80°CUL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹80°CUL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹80°CUL 746B

Table 4 of 7

4 rows
CharacteristicValueUnitMethod
Volume Resistivity ¹¹1.00E+16Ω.cmASTM D257
Surface Resistivity ¹¹1.00E+16ΩASTM D257
Relative Permittivity (1 GHz) ¹¹3.03—ASTM D150
Dissipation Factor (at at 1 GHz) ¹¹0.0066—ASTM D150

Table 5 of 7

2 rows
CharacteristicValueUnitMethod
Izod Impact (Notched, at 23°C) ¹¹700J/mASTM D256
Izod Impact (Notched, 80*10*3, at 23°C) ¹¹60kJ/m²ISO 180/1A

Table 6 of 7

10 rows
CharacteristicValueUnit
Drying Temperature ⁷110 - 120°C
Drying Time ⁷2 - 4Hrs
Maximum Moisture Content ⁷0.02%
Melt Temperature ⁷260 - 280°C
Nozzle Temperature ⁷255 - 275°C
Front - Zone 3 Temperature ⁷260 - 280°C
Middle - Zone 2 Temperature ⁷260 - 280°C
Rear - Zone 1 Temperature ⁷245 - 265°C
Hopper Temperature ⁷40 - 60°C
Mold Temperature ⁷80 - 140°C

Table 7 of 7

1 row
CharacteristicValueUnitMethod
UL Recognized (94HB Flame Class Rating) ᵖmin. 1mmUL 94

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