LNP™ THERMOCOMP™ Compound WC006
- Chemical Family
- Polyesters
SABIC's Specialties Business LNP THERMOCOMP WC006 compound is based on Polybutylene Terephthalate (PBT) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Consumer Goods — Sports & Recreation
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polyesters & Copolyesters
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polybutylene Terephthalate (PBT)
- Fillers Included
- Carbon Fiber
- Flexural Modulus
- 15160.0 - 15160.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- Electrically Conductive
- High Stiffness
- High Strength
- Light Weight
- No Added PFAS
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Appliances
- Building Materials
- Cell Phones
- Commercial Appliance
- Computer Components
- Consumer Applications
- Containers
- Displays
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
18 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, 5 mm/min) ¹¹ | 151 | MPa | ISO 527 |
| Tensile Stress (Yield) ¹¹ | 158 | MPa | ASTM D638 |
| Tensile Stress (Yield) ¹¹ | 158 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1 - 2 | % | ISO 527 |
| Tensile Stress (Break) ¹¹ | 158 | MPa | ASTM D638 |
| Tensile Stress (Break) ¹¹ | 158 | MPa | ISO 527 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 214 | MPa | ISO 178 |
| Tensile Strain (Yield) ¹¹ | 1.2 | % | ASTM D638 |
| Tensile Strain (Yield) ¹¹ | 1.2 | % | ISO 527 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 16100 | MPa | ISO 178 |
| Tensile Strain (Break) ¹¹ | 1.2 | % | ISO 527 |
| Tensile Strain (Break) ¹¹ | 1.2 | % | ASTM D638 |
Table 2 of 6
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mold Shrinkage (on Tensile Bar, flow) ᵍ ¹¹ | 0.1 - 0.2 | % | SABIC method |
| Density ¹¹ | 1.43 | g/cm³ | ISO 1183 |
| Density ¹¹ | 1.43 | g/cm³ | ASTM D792 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.1 - 0.3 | % | ASTM D955 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.23 | % | ISO 294 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 1 - 2 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 1.2 | % | ISO 294 |
Table 3 of 6
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 222 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 211 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.0000126 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000012 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000012 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000068 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000068 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 223 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 209 | °C | ISO 75/Af |
Table 4 of 6
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity ¹¹ | 10 - 1000 | Ω | ASTM D257 |
Table 5 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 30 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 4 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 464 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 42 | J/m | ASTM D256 |
| Instrumented Dart Impact Energy (Peak, at 23°C) ¹¹ | 8 | J | ASTM D3763 |
| Multi-Axial Impact ¹¹ | 2 | J | ISO 6603 |
Table 6 of 6
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.05 | % |
| Melt Temperature ⁷ | 240 - 265 | °C |
| Front - Zone 3 Temperature ⁷ | 260 - 270 | °C |
| Middle - Zone 2 Temperature ⁷ | 245 - 255 | °C |
| Rear - Zone 1 Temperature ⁷ | 220 - 230 | °C |
| Mold Temperature ⁷ | 80 - 100 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
