LNP™ THERMOCOMP™ Compound NX11302
SABIC's Specialties Business LNP™ THERMOCOMP™ NX11302 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Colorable, Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Interior
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Blends & Alloys
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Density
- 1220.0 - 1220.0 kg/m³
- Polymer Name
- PC/ABS Alloy
- Processing Methods
- Injection Molding, Laser Sintering (SLS)
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Color
- White
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Fillers Included
- Talc
- Additives Included
- Heat Stabilizer
- Impact Modifier
- Metal Deactivator
- Mold Release Agent
- Material Features
- Cost Effective
- Excellent Dielectric Properties
- Good Colorability
- Good Mold Release
- Heat Stabilized
- Impact Modified
- Pigmentable
- Unreinforced
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Automotive Applications
- Automotive Interior Parts
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Laser Sintering (SLS)
Technical data
Table 1 of 7
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, Type I, 50 mm/min) ¹¹ | 47 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹¹ | 46 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 50 mm/min) ¹¹ | 4.6 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 75 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 2350 | MPa | ASTM D638 |
| Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹ | 79 | MPa | ASTM D790 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 78 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 2230 | MPa | ASTM D790 |
Table 2 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.22 | g/cm³ | ASTM D792 |
| Water Absorption (at 23°C, 24hrs) ¹¹ | 0.01 | % | ASTM D570 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.01 | % | ASTM D570 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.6 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.6 | % | ASTM D955 |
| Melt Volume Rate (at 260°C, 5.0 kg) ¹¹ | 14 | cm³/10 min | ISO 1133 |
Table 3 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 106 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000071 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000076 | 1/°C | ASTM E831 |
| Relative Temperature Index (Electrical) ᵖ ¹¹ | 60 | °C | UL 746B |
| Relative Temperature Index (Mechanical with impact) ᵖ ¹¹ | 60 | °C | UL 746B |
| Relative Temperature Index (Mechanical without impact) ᵖ ¹¹ | 60 | °C | UL 746B |
Table 4 of 7
2 rows| Characteristic | Value | Method |
|---|---|---|
| Relative Permittivity (1 GHz) ¹¹ | 2.94 | IEC 60250 |
| Dissipation Factor (at at 1 GHz) ¹¹ | 0.0057 | IEC 60250 |
Table 5 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 550 | J/m | ASTM D256 |
Table 6 of 7
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 85 - 95 | °C |
| Drying Time ⁷ | 2 - 4 | Hrs |
| Drying Time (Cumulative) ⁷ | 8 | Hrs |
| Maximum Moisture Content ⁷ | 0.01 | % |
| Melt Temperature ⁷ | 220 - 260 | °C |
| Nozzle Temperature ⁷ | 220 - 260 | °C |
| Front - Zone 3 Temperature ⁷ | 215 - 255 | °C |
| Middle - Zone 2 Temperature ⁷ | 215 - 255 | °C |
| Rear - Zone 1 Temperature ⁷ | 200 - 250 | °C |
| Mold Temperature ⁷ | 40 - 75 | °C |
| Back Pressure ⁷ | 0.5 - 0.9 | MPa |
| Screw Speed ⁷ | 50 - 100 | rpm |
Table 7 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94HB Flame Class Rating) ᵖ | min. 0.6 | mm | UL 94 |
