LNP™ THERMOCOMP™ Compound TF002
- Chemical Family
- Polyurethanes (PU)
SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Sports & Recreation
- Equipment & Parts
- Consumer Electronics
- Displays
- Housings & Enclosures
- Semiconductor Manufacturing
Product Families
- Polyurethanes
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Density
- 1310.0 - 1310.0 kg/m³
- End Uses
Appliances, Cell Phones, Commercial Appliance, Computer Components, Consumer Applications, Displays, Electrical Enclosure, Electrical Internal Frame, Electrical/Electronic Applications, Home Appliances, Industrial Applications, Internal Armature, Semiconductor Applications, Sporting Goods, Tablets
- Polymer Name
- Polyurethane (unspecified)
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Fillers Included
- Glass Fiber
- Material Features
- Cost Effective
- High Impact Performance
- High Impact Resistance
- No Added PFAS
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Appliances
- Cell Phones
- Commercial Appliance
- Computer Components
- Consumer Applications
- Displays
- Electrical Enclosure
- Electrical Internal Frame
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
13 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, Type I, 5 mm/min) ¹¹ | 42 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 38 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 5 mm/min) ¹¹ | 32.5 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 53 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 1460 | MPa | ASTM D638 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 900 | MPa | ASTM D790 |
| Tensile Stress (Yield, 5 mm/min) ¹¹ | 43 | MPa | ISO 527 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 40 | MPa | ISO 527 |
| Tensile Strain (Yield, 5 mm/min) ¹¹ | 33.6 | % | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 55.4 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 1260 | MPa | ISO 527 |
| Flexural Stress ¹¹ | 26 | MPa | ISO 178 |
Table 2 of 5
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.31 | — | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.4 | % | ASTM D570 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.6 - 0.8 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.7 - 0.9 | % | ASTM D955 |
| Density ¹¹ | 1.31 | g/cm³ | ISO 1183 |
| Moisture Absorption (at 23°C, 50% RH) ¹¹ | 0.61 | % | ISO 62 |
Table 3 of 5
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 152 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 67 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹ | 0.000089 | 1/°C | ASTM D696 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹ | 0.00017 | 1/°C | ASTM D696 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 148 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 61 | °C | ISO 75/Af |
Table 4 of 5
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 1230 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 334 | J/m | ASTM D256 |
| Multi-Axial Impact ¹¹ | 24 | J | ISO 6603 |
| Instrumented Dart Impact Total Energy (at 23°C) ¹¹ | 29 | J | ASTM D3763 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 129 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 31 | kJ/m² | ISO 180/1A |
Table 5 of 5
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 95 - 105 | °C |
| Drying Time ⁷ | 2 | Hrs |
| Maximum Moisture Content ⁷ | 0.03 | % |
| Melt Temperature ⁷ | 210 | °C |
| Nozzle Temperature ⁷ | 205 - 225 | °C |
| Front - Zone 3 Temperature ⁷ | 200 - 220 | °C |
| Middle - Zone 2 Temperature ⁷ | 195 - 215 | °C |
| Rear - Zone 1 Temperature ⁷ | 195 - 210 | °C |
| Mold Temperature ⁷ | 15 - 45 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
| Shot to Cylinder Size ⁷ | 40 - 80 | % |
