LNP™ THERMOCOMP™ Compound DC004E

Chemical Family: Polycarbonate (PC)

SABIC's Specialties Business LNP THERMOCOMP DC004E compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Lawn & Garden

Building & Construction — Decorative Materials & Finishes

Artificial Turf

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polycarbonates

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polycarbonate (PC)
Fillers Included: Carbon Fiber
Flexural Modulus: 11900.0 - 11900.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Building & Construction
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
ESD Protection
Easy To Mold
Electrically Conductive
Good Moldability
Good Processability
High Stiffness
High Strength
Country Availability: Canada
China (Mainland)
Mexico
USA
Certifications and Compliance: ATEX Directives
Plastics and Elastomers End Uses: Building Materials
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Doors
Electrical Components
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

5 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, 5 mm/min) ¹¹	165	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2.1	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	12200	MPa	ISO 527
Flexural Stress (Yield, at 2 mm/min) ¹¹	227	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	11900	MPa	ISO 178

Table 2 of 6

2 rows

Characteristic	Value	Unit	Method
Mold Shrinkage (on Tensile Bar, flow) ᵍ ¹¹	0.1 - 0.2	%	SABIC method
Density ¹¹	1.27	g/cm³	ISO 1183

Table 3 of 6

4 rows

Characteristic	Value	Unit	Method
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹	0.000009	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹	0.000065	1/°C	ISO 11359-2
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	141	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	136	°C	ISO 75/Af

Table 4 of 6

1 row

Characteristic	Value	Unit	Method
Surface Resistivity ¹¹	100 - 1000	Ω	ASTM D257

Table 5 of 6