LNP™ THERMOCOMP™ Compound UX08319

Chemical Family: Polyamides

SABIC's Specialties Business LNP THERMOCOMP UX08319 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Dielectric Properties. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Interior

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyphthalamide (PPA)
Fillers Included: Glass Fiber
Processing Methods: Injection Molding, Laser Sintering (SLS)
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Automotive & Transportation
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
Excellent Dielectric Properties
High Stiffness
High Temperature Resistance
No Added PFAS
Very Good Heat Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Automotive Applications
Automotive Interior Parts
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Electrical Components
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding
Laser Sintering (SLS)

Technical data

Table 1 of 6

5 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	125	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	1.4	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	13784	MPa	ASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹	185	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	11500	MPa	ASTM D790

Table 2 of 6

3 rows

Characteristic	Value	Unit	Method
Density ¹¹	2.14	g/cm³	ASTM D792
Mold Shrinkage (flow) ᵍ ¹¹	0.33	%	SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹	0.35	%	SABIC method

Table 3 of 6

1 row

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	265	°C	ASTM D648

Table 4 of 6

2 rows

Characteristic	Value	Method
Dielectric Constant (at 1.9 GHz) ¹¹	6.2	SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹	0.015	SABIC method

Table 5 of 6