LNP™ THERMOCOMP™ Compound D551
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP™ THERMOCOMP™ D551 compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.
Product families
- High Performance Thermoplastics
- Polycarbonates
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Glass Fiber
- Additives Included
Flame Retardant, Heat Stabilizer, Mold Release Agent; Flame Retardant; Heat Stabilizer; Mold Release Agent
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Flame Rating
- UL 94 V0
- UL 94 V1
- Technology
- Plastics
- Labeling Claims
- Bromine-free
- Chlorine-free
- Material Features
- Cost Effective
- Flame Retardant
- Good Mold Release
- Heat Stabilized
- High Ductility
- High Impact Resistance
- High Modulus
- High Stiffness
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Potential Applications
PC based LNP THERMOCOMP™ compounds may be qualified to use in consumer electronics, industrial applications for combination of dimensional stability, thin wall and non-Br/Cl Eco FR systems.
- Certifications and Compliance
- UL 94
Technical data
Table 1 of 7
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 154 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 2.1 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 15320 | MPa | ASTM D638 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 223 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 13820 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 153 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1.9 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 15130 | MPa | ISO 527 |
Table 2 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.635 | g/cm³ | ASTM D792 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.05 - 0.2 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.05 - 0.2 | % | ASTM D955 |
| Melt Volume Rate (at 300°C, 2.16 kg) ¹¹ | 17 | cm³/10 min | ASTM D1238 |
| Melt Flow Rate (at 300°C, 5.0 kgf) ¹¹ | 48.6 | g/10 min | ASTM D1238 |
| Melt Volume Rate (at 300°C, 5.0 kg) ¹¹ | 29 | cm³/10 min | ASTM D1238 |
Table 3 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 107 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.0000139 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.0000415 | 1/°C | ASTM E831 |
| Relative Temperature Index (Electrical) ᵖ ¹¹ | 80 | °C | UL 746B |
| Relative Temperature Index (Mechanical with impact) ᵖ ¹¹ | 80 | °C | UL 746B |
| Relative Temperature Index (Mechanical without impact) ᵖ ¹¹ | 80 | °C | UL 746B |
Table 4 of 7
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Volume Resistivity ¹¹ | 2.15E+16 | Ω.cm | ASTM D257 |
| Surface Resistivity ¹¹ | 5.00E+16 | Ω | ASTM D257 |
| Dielectric Constant (at 1.1 GHz) ¹¹ | 4.07 | — | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 4.1 | — | SABIC method |
| Dielectric Constant (at 5 GHz) ¹¹ | 4.09 | — | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.00762 | — | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.00811 | — | SABIC method |
| Dissipation Factor (at 5 GHz) ¹¹ | 0.00896 | — | SABIC method |
Table 5 of 7
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 520 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 127 | J/m | ASTM D256 |
| Instrumented Dart Impact Energy (Peak, at 23°C) ¹¹ | 21 | J | ASTM D3763 |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹ | 12 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹ | 38 | kJ/m² | ISO 179/1eU |
Table 6 of 7
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 110 | °C |
| Drying Time ⁷ | 3 - 6 | Hrs |
| Drying Time (Cumulative) ⁷ | 12 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 285 - 310 | °C |
| Nozzle Temperature ⁷ | 285 - 305 | °C |
| Front - Zone 3 Temperature ⁷ | 280 - 300 | °C |
| Middle - Zone 2 Temperature ⁷ | 270 - 290 | °C |
| Rear - Zone 1 Temperature ⁷ | 260 - 280 | °C |
| Mold Temperature ⁷ | 80 - 110 | °C |
| Back Pressure ⁷ | 0.1 - 0.3 | MPa |
| Screw Speed ⁷ | 50 - 90 | rpm |
Table 7 of 7
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94V-0 Flame Class Rating) ᵖ | min. 1 | mm | UL 94 |
| UL Recognized (94V-1 Flame Class Rating) ᵖ | min. 0.8 | mm | UL 94 |
