LNP™ THERMOCOMP™ Compound UX08325
- Chemical Family
- Polyamides
SABIC's Specialties Business LNP™ THERMOCOMP™ UX08325 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, SMT Process capable.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Interior
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polyamides
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 9610.0 - 9610.0 MPa
- Additives Included
- Mold Release Agent
- Processing Methods
- Injection Molding, Laser Sintering (SLS)
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Material Features
- Cost Effective
- Excellent Dielectric Properties
- Good Mold Release
- High Modulus
- High Stiffness
- High Temperature Resistance
- Surface Mount Technology
- UL Listed
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- 5G Dipole Antenna
- Automotive Applications
- Automotive Interior Parts
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Laser Sintering (SLS)
Technical data
Table 1 of 7
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 135 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 1.8 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 10880 | MPa | ASTM D638 |
| Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹ | 197 | MPa | ASTM D790 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 194 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 9770 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 125 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1.6 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 11080 | MPa | ISO 527 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 194 | MPa | ISO 178 |
| Flexural Strain (Break, at 2 mm/min) ¹¹ | 2 | % | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 9610 | MPa | ISO 178 |
Table 2 of 7
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.55 | g/cm³ | ASTM D792 |
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.41 | % | SABIC method |
| Mold Shrinkage (xflow) ᵍ ¹¹ | 0.52 | % | SABIC method |
| Moisture Absorption (at 23°C, 50% RH) ¹¹ | 0.53 | % | ISO 62 |
Table 3 of 7
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 263 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000022 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000054 | 1/°C | ASTM E831 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 261 | °C | ISO 75/Af |
Table 4 of 7
2 rows| Characteristic | Value | Method |
|---|---|---|
| Relative Permittivity (1 GHz) ¹¹ | 4.2 | ASTM D150 |
| Dissipation Factor (at at 1 GHz) ¹¹ | 0.01 | ASTM D150 |
Table 5 of 7
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 351 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 31 | J/m | ASTM D256 |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 2 | kJ/m² | ISO 180/1A |
Table 6 of 7
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 - 150 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.15 | % |
| Melt Temperature ⁷ | 315 - 330 | °C |
| Front - Zone 3 Temperature ⁷ | 325 - 340 | °C |
| Middle - Zone 2 Temperature ⁷ | 315 - 325 | °C |
| Rear - Zone 1 Temperature ⁷ | 310 - 320 | °C |
| Mold Temperature ⁷ | 140 - 165 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
Table 7 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94HB Flame Class Rating) ᵖ | min. 1.5 | mm | UL 94 |
