LNP™ THERMOCOMP™ Compound UF0067V

Chemical Family: Polyamides

SABIC's Specialties Business LNP THERMOCOMP UF0067V compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, High Heat Resistance, SMT Process capable, Non-Brominated, Non-Chlorinated Flame Retardant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Interior

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyphthalamide (PPA)
Fillers Included: Glass Fiber
Additives Included: Flame Retardant, Heat Stabilizer
Flame Retardant
Heat Stabilizer
Processing Methods: Injection Molding, Laser Sintering (SLS)
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Automotive & Transportation
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Flame Rating: UL 94 V0
Technology: Plastics
Labeling Claims: Bromine-free
Chlorine-free
No Added PFAS
Material Features: Cost Effective
Excellent Dielectric Properties
Flame Retardant
Heat Stabilized
High Modulus
High Stiffness
High Temperature Application
No Added PFAS
Country Availability: Canada
China (Mainland)
Mexico
USA
Certifications and Compliance: UL 94
Plastics and Elastomers End Uses: Automotive Interior Parts
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Electrical Components
Electrical Enclosure
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding
Laser Sintering (SLS)

Technical data

Table 1 of 7

4 rows

Characteristic	Value	Unit	Method
Mold Shrinkage (flow) ᵍ ¹¹	0.3	%	SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹	0.5	%	SABIC method
Specific Gravity ¹¹	1.45	—	ASTM D792
Water Absorption (at 23°C, 24hrs) ¹¹	0.05	%	ISO 62-1

Table 2 of 7

5 rows

Characteristic	Value	Unit	Method
Tensile Modulus (at 5 mm/min) ¹¹	9500	MPa	ASTM D638
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	104	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	1.6	%	ASTM D638
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	8500	MPa	ASTM D790
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹	150	MPa	ASTM D790

Table 3 of 7

5 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm) ¹¹	276	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2 mm) ¹¹	255	°C	ASTM D648
Relative Temperature Index (Electrical) ᵖ ¹¹	65	°C	UL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹	65	°C	UL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹	65	°C	UL 746B

Table 4 of 7

2 rows

Characteristic	Value	Method
Dielectric Constant (at 1.1 GHz) ¹¹	3.56	SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹	0.009	SABIC method

Table 5 of 7