LNP™ THERMOCOMP™ Compound RC008H

Chemical Family: Polyamides

SABIC's Specialties Business LNP THERMOCOMP RC008H compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Healthcare & Pharma — Medical

Medical Devices & Assemblies
Surgical Instruments & Trays

Printing & Packaging — Packaging

Healthcare Packaging
Industrial & Transport Packaging

Electrical & Electronics — Parts & Components

Housings & Enclosures

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyamide 66 (PA 66)
Fillers Included: Carbon Fiber
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Electrical & Electronics
Healthcare & Pharma
Printing & Packaging
Flame Rating: UL 94 HB
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
Electrically Conductive
High Stiffness
High Strength
Light Weight
No Added PFAS
Country Availability: Canada
China (Mainland)
Mexico
USA
Certifications and Compliance: UL 94
Plastics and Elastomers End Uses: Electrical Enclosure
Electrical Internal Frame
Internal Armature
Medical Devices
Medical Packaging
Medical/Healthcare Applications
Pharmaceutical Packaging
Surgical Devices
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

5 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	288	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	1.8	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	32000	MPa	ASTM D638
Flexural Stress (Break, 2.6 mm/min, 100 mm span) ¹¹	429	MPa	ASTM D790
Flexural Modulus (at 2.6 mm/min, 100 mm span) ¹¹	26100	MPa	ASTM D790

Table 2 of 6

6 rows

Characteristic	Value	Unit	Method
Specific Gravity ¹¹	1.33	—	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.54	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.2 - 0.4	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.4 - 0.6	%	ASTM D955
Density ¹¹	1.34	g/cm³	ISO 1183
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.78	%	ISO 62

Table 3 of 6

8 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	2.55E+02	°C	ASTM D648
Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹	0.000011	1/°C	ASTM D696
Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹	0.000037	1/°C	ASTM D696
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	261	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	2.52E+02	°C	ISO 75/Af
Relative Temperature Index (Electrical) ᵖ ¹¹	65	°C	UL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹	65	°C	UL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹	65	°C	UL 746B

Table 4 of 6