LNP™ THERMOCOMP™ Compound OFC08

Chemical Family: Polyphenylene Sulfide (PPS)

SABIC's Specialties Business LNP THERMOCOMP OFC08 compound is based on Polyphenylene sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Good Impact Strength and Ductility, Excellent Heat and Chemical Resistance, Good Electrical properties and Inherently Flame-Retardant. It is also an Easy Flow grade with Good Flash Control. Applications of this grade include electric and electronic components, and various parts requiring high strength and high heat resistant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyphenylene Sulfide (PPS)
Fillers Included: Glass Fiber
Flexural Modulus: 15000.0 - 15000.0 MPa
Additives Included: Flame Retardant
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Flame Rating: UL 94 V0
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Chemical Resistant
Cost Effective
Excellent Dielectric Properties
Flame Retardant
Good Electrical Properties
High Degree of Linearity
High Ductility
High Impact Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Certifications and Compliance: UL 94
Plastics and Elastomers End Uses: Cell Phones
Computer Components
Displays
Electrical Components
Electrical Enclosure
Electrical Internal Frame
Electrical/Electronic Applications
Internal Armature
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 7

10 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	195	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	2.2	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	16000	MPa	ASTM D638
Tensile Stress (Break, 5 mm/min) ¹¹	200	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2.2	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	16000	MPa	ISO 527
Flexural Strength (at 1.3 mm/min, 50 mm span) ¹¹	295	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	15300	MPa	ASTM D790
Flexural Strength (at 2 mm/min) ¹¹	295	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	15000	MPa	ISO 178

Table 2 of 7

9 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.66	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.01	%	ISO 62-4
Water Absorption (at 23°C, 24hrs) ¹¹	0.02	%	ISO 62-1
Water Absorption (at 23°C, 24hrs) ¹¹	0.01	%	ASTM D570
Water Absorption (at 23°C, saturated) ¹¹	0.03	%	ISO 62-1
Melt Flow Rate (at 315°C, 5.0 kgf) ¹¹	25	g/10 min	ASTM D1238
Melt Volume Rate (at 315°C, 5.0 kg) ¹¹	15	cm³/10 min	ISO 1133
Mold Shrinkage (flow) ᵍ ¹¹	0.2 - 0.3	%	SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹	0.4 - 0.6	%	SABIC method

Table 3 of 7

11 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	265	°C	ASTM D648
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	275	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	270	°C	ISO 75/Af
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	275	°C	ISO 75/Bf
Coefficient of Thermal Expansion (at -40°C to 95°C, flow) ¹¹	0.00002	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 95°C, xflow) ¹¹	0.00005	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000015	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000045	1/°C	ISO 11359-2
Relative Temperature Index (Electrical) ᵖ ¹¹	130	°C	UL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹	130	°C	UL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹	130	°C	UL 746B

Table 4 of 7

2 rows

Characteristic	Value	Method
Dielectric Constant (at 1.9 GHz) ¹¹	4	SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹	0.0042	SABIC method

Table 5 of 7

8 rows

Characteristic	Value	Unit	Method
Izod Impact (Notched, at 23°C) ¹¹	100	J/m	ASTM D256
Izod Impact (Unnotched, at 23°C) ¹¹	480	J/m	ASTM D4812
Izod Impact (Notched, 80104, at 23°C) ¹¹	10	kJ/m²	ISO 180/1A
Izod Impact (Unnotched, 80104, at 23°C) ¹¹	50	kJ/m²	ISO 180/1U
Izod Impact (Notched, 80104, at -40°C) ¹¹	10	kJ/m²	ISO 180/1A
Izod Impact (Unnotched, 80104, at -40°C) ¹¹	50	kJ/m²	ISO 180/1U
Charpy Impact (at 23°C, V-notch Edgew 80103 sp=62mm) ¹¹	10	kJ/m²	ISO 179/1eA
Charpy Impact (at 23°C, Unnotch Edgew 80103 sp=62mm) ¹¹	55	kJ/m²	ISO 179/1eU

Table 6 of 7