LNP™ THERMOCOMP™ Compound WF006V
- Chemical Family
- Polyesters
LNP™ THERMOCOMP™ Compound WF006V is based on polybutylene terephthalate (pbt) reinforced with 30% glass fiber. This material offers fast plating capability and stable RF performance, along with wide processing windows and excellent chemical resistance. It is specifically designed for internal and external parts in Laser Direct Structuring (LDS) applications, where its combination of properties ensures reliability and performance. Ideal for applications requiring robustness and precision, this compound delivers consistent quality and versatility in manufacturing processes.
Product families
- Equipment & Parts
- Consumer Electronics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Note
¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design. ² Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
- Markets
- Electrical & Electronics
- Industrial
- Polymer Name
- Polybutylene Terephthalate (PBT)
- Labeling Claims
- No Added PFAS
- Fillers Included
- Glass Fiber
- Material Features
- Chemical Resistant
- Fast Plating
- High Stiffness
- High Strength
- Impact Resistance
- No Added PFAS
- Stable RF Performance
- Plastics and Elastomers End Uses
- Computer Components
- Earphones
- Electronic Components
- Speakers
- Tablets
- Wireless Communication
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Laser Direct Structuring (LDS)
Technical data
Table 1 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 50 mm/min) ¹ | 94.0 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹ | 2.5 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹ | 8049.0 | MPa | ASTM D638 |
| Flexural Strength (1.3 mm/min, 50 mm span) ¹ | 140.0 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹ | 7100.0 | MPa | ASTM D790 |
| Tensile Stress (Break, 50 mm/min) ¹ | 95.0 | MPa | ISO 527 |
| Tensile Strain (Break, 50 mm/min) ¹ | 2.55 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹ | 8260.0 | MPa | ISO 527 |
| Flexural Strength (2 mm/min) ¹ | 138.0 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹ | 6839.0 | MPa | ISO 178 |
Table 2 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹ | 1.5 | — | ASTM D792 |
| Melt Volume Rate (at 270°C/5 kg) ¹ | 12.3 | cm³/10 min | ISO 1133 |
| Mold Shrinkage (flow) ¹ | 0.3 | % | SABIC method |
| Mold Shrinkage (xflow) ¹ | 0.47 | % | SABIC method |
Table 3 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (0.45 MPa, 3.2 mm, unannealed) ¹ | 205.0 | °C | ASTM D648 |
| Heat Deflection Temperature (1.82 MPa, 3.2mm, unannealed) ¹ | 158.0 | °C | ASTM D648 |
| Heat Deflection Temperature/Bf (0.45 MPa Flatw 80*10*4 sp=64mm) ¹ | 204.0 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (1.8 MPa Flatw 80*10*4 sp=64mm) ¹ | 153.0 | °C | ISO 75/Af |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹ | 2.13e-05 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹ | 2.1e-05 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹ | 7.31e-05 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹ | 7.74e-05 | 1/°C | ISO 11359-2 |
| Vicat Softening Temperature (at Rate B/120) ¹ | 149.0 | °C | ISO 306 |
| Vicat Softening Temperature (at Rate B/120) ¹ | 148.0 | °C | ASTM D1525 |
Table 4 of 6
10 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹ | 3.503 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹ | 0.0106 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹ | 3.53 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹ | 0.0101 | SABIC method |
| Dielectric Constant (at 5 GHz) ¹ | 3.543 | SABIC method |
| Dissipation Factor (at 5 GHz) ¹ | 0.00923 | SABIC method |
| Dielectric Constant (at 10 GHz) ¹ | 3.54 | SABIC method |
| Dissipation Factor (at 10 GHz) ¹ | 0.00893 | SABIC method |
| Dielectric Constant (at 20 GHz) ¹ | 3.357 | SABIC method |
| Dissipation Factor (at 20 GHz) ¹ | 0.00869 | SABIC method |
Table 5 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, 23°C) ¹ | 116.0 | J/m | ASTM D256 |
| Izod Impact (Unnotched, 23°C) ¹ | 695.0 | J/m | ASTM D4812 |
| Izod Impact (Notched 80*10*4 +23°C) ¹ | 10.56 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched 80*10*4 +23°C) ¹ | 38.32 | kJ/m² | ISO 180/1U |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹ | 10.91 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹ | 45.91 | kJ/m² | ISO 179/1eU |
Table 6 of 6
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ² | 110 - 120 | °C |
| Drying Time ² | 3 - 5 | Hrs |
| Melt Temperature ² | 240 - 260 | °C |
| Nozzle Temperature ² | 240 - 260 | °C |
| Front - Zone 3 Temperature ² | 240 - 260 | °C |
| Middle - Zone 2 Temperature ² | 240 - 260 | °C |
| Rear - Zone 1 Temperature ² | 240 - 260 | °C |
| Mold Temperature ² | 110 - 130 | °C |
| Back Pressure ² | 0.1 - 0.3 | MPa |
| Screw Speed ² | 90 - 110 | rpm |
