LNP™ THERMOCOMP™ Compound LX04015

Chemical Family: Polyether Ether Ketone (PEEK)

LNP THERMOCOMP LX04015 compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

Product families

Applications

Consumer Goods — Appliances & Electronics

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays
Industrial Automation

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Semiconductor Manufacturing
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyetheretherketone (PEEK)
Fillers Included: Carbon Fiber
Flexural Modulus: 11100.0 - 11100.0 MPa
Additives Included: Mold Release Agent
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Industrial
Technology: Plastics
Material Features: Cost Effective
ESD Protection
Easy To Mold
Electrically Conductive
Good Mold Release
Good Moldability
Good Processability
High Stiffness
Country Availability: Canada
China (Mainland)
Mexico
USA
Certifications and Compliance: ATEX Directives
Plastics and Elastomers End Uses: Appliances
Cell Phones
Commercial Appliance
Computer Components
Consumer Applications
Displays
Electrical Components
Electrical Enclosure
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

6 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield, 5 mm/min) ¹¹	200	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	13800	MPa	ISO 527
Flexural Stress (Yield, at 2 mm/min) ¹¹	275	MPa	ISO 178
Flexural Strain (Break, at 2 mm/min) ¹¹	3.1	%	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	11100	MPa	ISO 178

Table 2 of 6

2 rows

Characteristic	Value	Unit	Method
Mold Shrinkage (flow) ᵍ ¹¹	0.1 - 0.3	%	SABIC method
Density ¹¹	1.34	g/cm³	ISO 1183

Table 3 of 6

3 rows

Characteristic	Value	Unit	Method
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹	0.00001	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹	0.000054	1/°C	ISO 11359-2
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	300	°C	ISO 75/Af

Table 4 of 6

1 row

Characteristic	Value	Unit	Method
Surface Resistivity ¹¹	10000 - 10000000	Ω	ASTM D257

Table 5 of 6