LEXAN™ Copolymer EXL9414P
SABIC's Specialties Business LEXAN EXL9414P polycarbonate (PC) siloxane copolymer resin is a medium flow, non-chlorinated, non-brominated flame retardant opaque injection molding (IM) grade. This resin offers low temperature ductility, thin wall flame retardant capability, and in combination with excellent processability and release with opportunities for shorter IM cycle times compared to standard PC. LEXAN EXL9414P copolymer resin is a product available in wide range of opaque colors and may be an excellent candidate for a wide variety of applications, especially the housing of fast-charging mobile phones.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Displays
- Advanced Materials
- Batteries
Product Families
- High Performance Thermoplastics
- Polycarbonates
Other characteristics
- Brand
- LEXAN™ Copolymer
- Polymer Name
- Polycarbonate-Siloxane Copolymer
- Flexural Modulus
- 2184.0 - 2184.0 MPa
- Additives Included
Flame Retardant, Heat Stabilizer, Mold Release Agent; Flame Retardant; Heat Stabilizer; Mold Release Agent
- Processing Methods
- Injection Molding
- Note
ʰ Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Labeling Claims
- Bromine-free
- Chlorine-free
- Material Features
- Excellent Low Temperature Ductility
- Flame Retardant
- Good Flow
- Good Mold Release
- Good Processability
- Heat Stabilized
- High Impact Performance
- High Impact Resistance
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Battery Pack
- Cell Phones
- Charger
- Computer Components
- Displays
- Drones
- Earphones
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Potential Benefits
- Impact
- Best-in-class ductility to -60 ºC with an outstanding balance of ductility and viscosity.
- Weatherability
- Excellent retention of mechanical properties upon outdoor exposure.
- Aging
- Better retention of properties vs. other polycarbonate resins.
- Flame retardance
- FR grades can be used in many ECO-compliant applications.
- Knitline strength
- A significant improvement over PC/ABS material
- Chemical resistance
- Improved chemical resistance to some chemicals compared to standard polycarbonate
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 7
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, Type I, 50 mm/min) ¹¹ | 55 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 50 mm/min) ¹¹ | 5.3 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 89 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 2117 | MPa | ASTM D638 |
| Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹ | 90 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 2200 | MPa | ASTM D790 |
| Tensile Stress (Yield, 50 mm/min) ¹¹ | 56 | MPa | ISO 527 |
| Tensile Strain (Yield, 50 mm/min) ¹¹ | 4.9 | % | ISO 527 |
| Tensile Strain (Break, 50 mm/min) ¹¹ | 63 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 2109 | MPa | ISO 527 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 86 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 2184 | MPa | ISO 178 |
Table 2 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.19 | — | ASTM D792 |
| Mold Shrinkage (flow) ʰ ¹¹ | 0.4 - 0.8 | % | SABIC method |
| Mold Shrinkage (xflow) ʰ ¹¹ | 0.4 - 0.8 | % | SABIC method |
| Melt Flow Rate (at 300°C, 1.2 kgf) ¹¹ | 13.5 | g/10 min | ASTM D1238 |
| Density ¹¹ | 1.19 | g/cm³ | ISO 1183 |
| Melt Volume Rate (at 300°C, 1.2 kg) ¹¹ | 12 | cm³/10 min | ISO 1133 |
Table 3 of 7
13 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 123 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 110 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.0000771 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.0000834 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at 23°C to 80°C, flow) ¹¹ | 0.0000911 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 80°C, xflow) ¹¹ | 0.0000954 | 1/°C | ISO 11359-2 |
| Vicat Softening Temperature (Rate B/50) ¹¹ | 137 | °C | ISO 306 |
| Vicat Softening Temperature (Rate B/120) ¹¹ | 138 | °C | ISO 306 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 111 | °C | ISO 75/Af |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 124 | °C | ISO 75/Bf |
| Relative Temperature Index (Electrical) ᵖ ¹¹ | 80 | °C | UL 746B |
| Relative Temperature Index (Mechanical with impact) ᵖ ¹¹ | 80 | °C | UL 746B |
Table 4 of 7
8 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹¹ | 2.87 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.006 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 2.82 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.006 | SABIC method |
| Dielectric Constant (at 5 GHz) ¹¹ | 2.82 | SABIC method |
| Dissipation Factor (at 5 GHz) ¹¹ | 0.006 | SABIC method |
| Dielectric Constant (at 10 GHz) ¹¹ | 2.83 | SABIC method |
| Dissipation Factor (at 10 GHz) ¹¹ | 0.006 | SABIC method |
Table 5 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 962 | J/m | ASTM D256 |
| Izod Impact (Notched, at -30°C) ¹¹ | 670 | J/m | ASTM D256 |
| Izod Impact (Notched, 80*10*3, at 23°C) ¹¹ | 77 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched, 80*10*3, at -30°C) ¹¹ | 51 | kJ/m² | ISO 180/1A |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*3 sp=62mm) ¹¹ | 81 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at -30°C, V-notch Edgew 80*10*3 sp=62mm) ¹¹ | 48 | kJ/m² | ISO 179/1eA |
Table 6 of 7
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 | °C |
| Drying Time ⁷ | 3 - 4 | Hrs |
| Drying Time (Cumulative) ⁷ | 48 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 295 - 315 | °C |
| Nozzle Temperature ⁷ | 290 - 310 | °C |
| Front - Zone 3 Temperature ⁷ | 295 - 315 | °C |
| Middle - Zone 2 Temperature ⁷ | 280 - 305 | °C |
| Rear - Zone 1 Temperature ⁷ | 270 - 295 | °C |
| Mold Temperature ⁷ | 70 - 95 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed ⁷ | 40 - 70 | rpm |
Table 7 of 7
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Glow Wire Ignitability Temperature (at 1.0 mm) ᵖ | 825 | °C | IEC 60695-2-13 |
| UL Recognized (94V-0 Flame Class Rating) ᵖ | 0.8 | mm | UL 94 |
