LNP™ COLORCOMP™ Compound E1000CE
- Chemical Family
- Polyetherimide (PEI)Polyimides (PI)
SABIC's Specialties Business LNP COLORCOMP E1000CE compound is based on unfilled Polyetherimide (PEI) resin. Added features of this grade include: Easy Molding, UV Stabilized, LNP Clean Compounding Technology.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Equipment & Parts
- Consumer Electronics
- Displays
- Industrial Automation
- Connectors
- Semiconductor Manufacturing
- Switches & Relays
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ COLORCOMP™ Compound
- Polymer Name
- Polyether Imide (PEI)
- Additives Included
- UV Stabilizer
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Color
- Custom
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Product Features
- VR: 10'7
- FM: 3.51GPa
- Low ionic
- FM4910 compliant
- Material Features
- Easy To Mold
- Excellent Aesthetics
- Good Aesthetics
- Good Moldability
- Good Processability
- Good Surface Appearance
- Good UV Stability
- Good Weather Stability
- Possible Applications
- FOUP housing
- SMIF POD housing
- Plastics and Elastomers End Uses
- Cell Phones
- Computer Components
- Displays
- Electrical Components
- Electrical/Electronic Applications
- Industrial Applications
- Semiconductor Applications
- Tablets
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 7
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, Type I, 5 mm/min) ¹¹ | 110 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 5 mm/min) ¹¹ | 7 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 60 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 3580 | MPa | ASTM D638 |
| Flexural Stress (Yield, 2.6 mm/min, 100 mm span) ¹¹ | 165 | MPa | ASTM D790 |
| Flexural Modulus (at 2.6 mm/min, 100 mm span) ¹¹ | 3510 | MPa | ASTM D790 |
| Hardness (Rockwell M) ¹¹ | 109 | — | ASTM D785 |
| Taber Abrasion (CS-17, 1 kg) ¹¹ | 10 | mg/1000cy | ASTM D1044 |
Table 2 of 7
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.27 | — | ASTM D792 |
| Water Absorption (at 23°C, 24hrs) ¹¹ | 0.25 | % | ASTM D570 |
| Water Absorption (at 23°C, saturated) ¹¹ | 1.25 | % | ASTM D570 |
| Mold Shrinkage (flow, 3.2 mm) ᵍ ¹¹ | 0.5 - 0.7 | % | SABIC method |
| Melt Flow Rate (at 337°C, 6.6 kgf) ¹¹ | 17.8 | g/10 min | ASTM D1238 |
Table 3 of 7
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Vicat Softening Temperature (Rate B/50) ¹¹ | 218 | °C | ASTM D1525 |
| Heat Deflection Temperature (at 0.45 MPa, 6.4 mm, Unannealed) ¹¹ | 207 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 6.4 mm, Unannealed) ¹¹ | 198 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -20°C to 150°C, flow) ¹¹ | 0.0000558 | 1/°C | ASTM E831 |
| Thermal Conductivity ¹¹ | 0.22 | W/m-°C | ASTM C177 |
Table 4 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Volume Resistivity ¹¹ | 1.00E+17 | Ω.cm | ASTM D257 |
| Dielectric Strength (in air, at 1.6mm) ¹¹ | 32.6 | kV/mm | ASTM D149 |
| Dielectric Strength (in oil, at 1.6mm) ¹¹ | 27.9 | kV/mm | ASTM D149 |
| Relative Permittivity (1 kHz) ¹¹ | 3.15 | — | ASTM D150 |
| Dissipation Factor (at at 1 kHz) ¹¹ | 0.0013 | — | ASTM D150 |
| Dissipation Factor (at 2450 MHz) ¹¹ | 0.0025 | — | ASTM D150 |
Table 5 of 7
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 1335 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 32 | J/m | ASTM D256 |
| Izod Impact (Reverse Notched, 3.2 mm) ¹¹ | 1174 | J/m | ASTM D256 |
| Color (at 23°C) ¹¹ | 3.30E+01 | J | ASTM D3029 |
Table 6 of 7
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 150 | °C |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 360 - 400 | °C |
| Rear - Zone 1 Temperature ⁷ | 360 - 380 | °C |
| Middle - Zone 2 Temperature ⁷ | 370 - 390 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 400 | °C |
| Nozzle Temperature ⁷ | 390 - 400 | °C |
| Mold Temperature ⁷ | 140 - 180 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed (Circumferential speed) ⁷ | 0.2 - 0.3 | m/s |
| Vent Depth ⁷ | 0.025 - 0.076 | mm |
Table 7 of 7
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Oxygen Index (LOI) | 44 | % | ASTM D2863 |
| NBS Smoke Density (Flaming, Ds 4 min) | 2 | — | ASTM E662 |
