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LNP™ STAT-KON™ Compound DX96573C

Chemical Family
Polycarbonate (PC)

SABIC's Specialties Business LNP STAT-KON DX96573C compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, LNP Clean Compounding Technology. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Displays
  • Industrial Automation
Electrical & Electronics — Parts & Components
  • Connectors
  • Semiconductor Manufacturing
  • Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers
  • High Performance Thermoplastics
  • Polycarbonates

Other characteristics

Brand
LNP™ STAT-KON™ Compound
Polymer Name
Polycarbonate (PC)
Fillers Included
  • Carbon Black, Carbon Powder
  • Carbon Black
  • Carbon Powder
Processing Methods
Injection Molding
Note

ᵈ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding. Do NOT mix NORYL GTX* resin with other grades of NORYL* resins. Polystyrene and acrylic regrind are effective purging Materials. Use temperature range appropriate for particular purging resin. Regrind must also be dried. Maximum 25% regrind. Dry at recommended temperatures and times for optimum performance. Overdrying can cause loss of physical properties and/or create appearance defects. Do not exceed recommended basic drying time and temperature above or:\n4-8 hrs at 95°C (200°F), 10 hrs max\n6-12 hrs at 80°C (175°F), 16 hrs max\n8-16 hrs at 65°C (150°F), 24 hrs max\nAVOID air circulating tray ovens. Moisture levels in heated ambient air can exceed moisture level in the resin itself, causing moisture ABSORPTION not drying. Avoid melt temperature in excess of 300°C (575°F) and residence times over 6-8 minutes (may affect properties and/or appearance). Nozzle temperature controls assist in elimination of drool premature freeze-off. Shot sizes in excess of 50% barrel capacity can lead to difficulties in providing a consistent, homogenous plastic melt.; ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

Markets
  • Consumer Goods
  • Electrical & Electronics
  • Industrial
Technology
Plastics
Labeling Claims
No Added PFAS
Material Features
  • Electrically Conductive
  • Low Liquid Particle Count
  • Low Outgassing
  • No Added PFAS
Country Availability
  • Canada
  • China (Mainland)
  • Mexico
  • USA
Plastics and Elastomers End Uses
  • Cell Phones
  • Computer Components
  • Displays
  • Electrical Components
  • Electrical/Electronic Applications
  • Industrial Applications
  • Semiconductor Applications
  • Tablets
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 6

6 rows
CharacteristicValueUnitMethod
Specific Gravity ¹¹1.25—ASTM D792
Density ¹¹1.25g/cm³ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.74%ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹0.85%ASTM D955
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹0.15%ASTM D570
Moisture Absorption (at 23°C, 50% RH) ¹¹0.23%ISO 62

Table 2 of 6

13 rows
CharacteristicValueUnitMethod
Tensile Modulus (at 5 mm/min) ¹¹3008MPaASTM D638
Tensile Stress (Yield, Type I, 5 mm/min) ¹¹64MPaASTM D638
Tensile Stress (Break, Type I, 5 mm/min) ¹¹54MPaASTM D638
Tensile Strain (Yield, Type I, 5 mm/min) ¹¹4.9%ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹20%ASTM D638
Tensile Modulus (at 1 mm/min) ¹¹2913MPaISO 527
Tensile Stress (Yield, 5 mm/min) ¹¹63MPaISO 527
Tensile Stress (Break, 5 mm/min) ¹¹54MPaISO 527
Tensile Strain (Yield, 5 mm/min) ¹¹4.9%ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹20%ISO 527
Flexural Modulus ¹¹2890MPaASTM D790
Flexural Modulus ¹¹2771MPaISO 178

Table 3 of 6

6 rows
CharacteristicValueUnitMethod
Heat Deflection Temperature (at 1.8 MPa, 3.2 mm, Unannealed) ¹¹133°CASTM D648
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹142°CASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹131°CISO 75/Af
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹142°CISO 75/Bf
Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹0.0000621/°CASTM E831
Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹0.0000631/°CASTM E831

Table 4 of 6

1 row
CharacteristicValueUnitMethod
Surface Resistivity ᵈ ¹¹100 - 100000ΩASTM D257

Table 5 of 6

6 rows
CharacteristicValueUnitMethod
Izod Impact (Notched, at 23°C) ¹¹65.8J/mASTM D256
Izod Impact (Unnotched, at 23°C) ¹¹No breakJ/mASTM D4812
Instrumented Dart Impact Total Energy (at 23°C) ¹¹41JASTM D3763
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹7.5kJ/m²ISO 180/1A
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹No breakkJ/m²ISO 180/1U
Multi-Axial Impact ¹¹38JISO 6603

Table 6 of 6

10 rows
CharacteristicValueUnit
Drying Temperature ⁷121°C
Drying Time ⁷4Hrs
Melt Temperature ⁷304 - 326°C
Front - Zone 3 Temperature ⁷321 - 332°C
Middle - Zone 2 Temperature ⁷310 - 321°C
Rear - Zone 1 Temperature ⁷293 - 304°C
Mold Temperature ⁷82 - 110°C
Back Pressure ⁷0.17 - 0.34MPa
Screw Speed ⁷30 - 60rpm
Maximum Moisture Content ⁷0.02%

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