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LNP™ ELCRIN™ EXL8452TCC

LNP™ ELCRIN™ EXL8452TCC is a polycarbonate (pc) siloxane copolymer resin with 50% post-consumer recycled (pcr) content, designed for transparent injection molding applications. This resin offers excellent low-temperature ductility (-20~-30 °C), along with medium flow characteristics and exceptional processability, potentially reducing injection molding cycle times compared to standard PC. Available in transparent and opaque colors, this is a versatile product suitable for a broad range of applications.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
Automotive & Transportation — Transportation
  • Off Road & Recreational Vehicle (RV)

Product Families

Plastics — Engineering & Specialty Polymers
  • Polycarbonates

Other characteristics

Brand
LNP™ ELCRIN
Polymer Name
Polycarbonate-Siloxane Copolymer
Flexural Modulus
2240.0 - 2240.0 MPa
Processing Methods
Injection Molding
Note

¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design. ² UL Ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card. ³ Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article. ⁴ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.

Color
  • Opaque
  • Transparent
Markets
  • Automotive & Transportation
  • Consumer Goods
  • Electrical & Electronics
Technology
Plastics
Labeling Claims
  • Contains PCR Resin
  • No Added PFAS
Material Features
  • Excellent Low Temperature Ductility
  • Good Processability
  • Impact Resistance
  • Low Temperature Impact Resistance
  • Medium Flow
  • No Added PFAS
  • Shorter Cycle Time
  • Unreinforced
Plastics and Elastomers End Uses
  • Building Materials
  • Computer Components
  • Home Appliances
  • Personal Accessories
  • Tablets
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 8

16 rows
CharacteristicValueUnitMethod
Tensile Stress (Yield, Type I, 50 mm/min) ¹59.0MPaASTM D638
Tensile Stress (Break, Type I, 50 mm/min) ¹65.0MPaASTM D638
Tensile Strain (Yield, Type I, 50 mm/min) ¹6.0%ASTM D638
Tensile Strain (Break, Type I, 50 mm/min) ¹110.0%ASTM D638
Tensile Modulus (at 50 mm/min) ¹2200.0MPaASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹95.0MPaASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹2290.0MPaASTM D790
Tensile Stress (Yield, 50 mm/min) ¹59.0MPaISO 527
Tensile Stress (Break, 50 mm/min) ¹61.0MPaISO 527
Tensile Strain (Yield, 50 mm/min) ¹5.9%ISO 527
Tensile Strain (Break, 50 mm/min) ¹110.0%ISO 527
Tensile Modulus (at 1 mm/min) ¹2240.0MPaISO 527

Table 2 of 8

6 rows
CharacteristicValueUnitMethod
Specific Gravity ¹1.2—ASTM D792
Mold Shrinkage (flow, 3.2 mm) ²0.4 - 0.8%SABIC method
Mold Shrinkage (xflow, 3.2 mm) ²0.4 - 0.8%SABIC method
Melt Flow Rate (at 300°C/1.2 kgf) ¹12.0g/10 minASTM D1238
Density ¹1.19g/cm³ISO 1183
Melt Volume Rate (at 300°C/1.2 kg) ¹11.0cm³/10 minISO 1133

Table 3 of 8

10 rows
CharacteristicValueUnitMethod
Heat Deflection Temperature (0.45 MPa, 3.2 mm, unannealed) ¹135.0°CASTM D648
Heat Deflection Temperature (1.82 MPa, 3.2mm, unannealed) ¹122.0°CASTM D648
Heat Deflection Temperature/Bf (0.45 MPa Flatw 80*10*4 sp=64mm) ¹136.0°CISO 75/Bf
Heat Deflection Temperature/Af (1.8 MPa Flatw 80*10*4 sp=64mm) ¹122.0°CISO 75/Af
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹7.3e-051/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹7.4e-051/°CASTM E831
Coefficient of Thermal Expansion (at 23°C to 80°C, flow) ¹7.7e-051/°CISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 80°C, xflow) ¹8.3e-051/°CISO 11359-2
Vicat Softening Temperature (at Rate B/50) ¹141.0°CISO 306
Vicat Softening Temperature (at Rate B/120) ¹142.0°CISO 306

Table 4 of 8

10 rows
CharacteristicValueUnitMethod
Volume Resistivity ¹min. 1E+16Ω.cmASTM D257
Surface Resistivity ¹min. 1E+16ΩASTM D257
Dielectric Constant (at 1.1 GHz) ¹2.86—SABIC method
Dielectric Constant (at 1.9 GHz) ¹2.79—SABIC method
Dielectric Constant (at 5 GHz) ¹2.8—SABIC method
Dielectric Constant (at 10 GHz) ¹2.84—SABIC method
Dissipation Factor (at 1.1 GHz) ¹0.0061—SABIC method
Dissipation Factor (at 1.9 GHz) ¹0.0056—SABIC method
Dissipation Factor (at 5 GHz) ¹0.0051—SABIC method
Dissipation Factor (at 10 GHz) ¹0.0054—SABIC method

Table 5 of 8

2 rows
CharacteristicValueUnitMethod
Light Transmission (at 2.54 mm) ¹86.0%ASTM D1003
Haze (2.54 mm) ¹2.0%ASTM D1003

Table 6 of 8

11 rows
CharacteristicValueUnitMethod
Izod Impact (Notched, 23°C) ¹950.0J/mASTM D256
Izod Impact (Notched, 0°C) ¹870.0J/mASTM D256
Izod Impact (Notched, -20°C) ¹600.0J/mASTM D256
Izod Impact (Notched, -30°C) ¹320.0J/mASTM D256
Izod Impact (Notched, -40°C) ¹200.0J/mASTM D256
Instrumented Dart Impact Total Energy (at 23°C) ¹77.0JASTM D3763
Instrumented Dart Impact Total Energy (at -30°C) ¹82.0JASTM D3763
Izod Impact (Notched 80*10*3 +23°C) ¹73.0kJ/m²ISO 180/1A
Izod Impact (Notched 80*10*3 -30°C) ¹24.0kJ/m²ISO 180/1A
Charpy Impact (at 23°C, V-notch Edgew 80*10*3 sp=62mm) ¹79.0kJ/m²ISO 179/1eA
Charpy Impact (at -30°C, V-notch Edgew 80*10*3 sp=62mm) ¹26.0kJ/m²ISO 179/1eA

Table 7 of 8

14 rows
CharacteristicValueUnit
Drying Temperature ⁴120.0°C
Drying Time ⁴3 - 4Hrs
Drying Time (Cumulative) ⁴48.0Hrs
Maximum Moisture Content ⁴0.02%
Melt Temperature ⁴295 - 315°C
Nozzle Temperature ⁴290 - 310°C
Front - Zone 3 Temperature ⁴295 - 315°C
Middle - Zone 2 Temperature ⁴280 - 305°C
Rear - Zone 1 Temperature ⁴275 - 295°C
Mold Temperature ⁴70 - 95°C
Back Pressure ⁴0.3 - 0.7MPa
Screw Speed ⁴40 - 70rpm

Table 8 of 8

8 rows
CharacteristicValueUnitMethod
UL Recognized 94HB Flame Class Rating ³min. 0.4mmUL 94
Oxygen Index (LOI) ¹36.0%ISO 4589
Glow Wire Flammability Index (at 1.0 mm) ¹900.0°CIEC 60695-2-12
Glow Wire Flammability Index (at 2.0 mm) ¹960.0°CIEC 60695-2-12
Glow Wire Flammability Index (at 3.0 mm) ¹960.0°CIEC 60695-2-12
Glow Wire Ignitability Temperature (at 1.0 mm) ¹875.0°CIEC 60695-2-13
Glow Wire Ignitability Temperature (at 2.0 mm) ¹875.0°CIEC 60695-2-13
Glow Wire Ignitability Temperature (at 3.0 mm) ¹850.0°CIEC 60695-2-13

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