Dianhydrides & Imides BISDA

Chemical Name: 4,4-Bisphenol A Dianhydride, 44-Bisphenol A Dianhydride
Chemical Family: Anhydrides

Dianhydrides & Imides BISDA (4,4-bisphenol A dianhydride, dianhydrides of BPA) are flakes that can serve as a comonomer in polyimide synthesis or as an anhydride curing agent in epoxy applications. When utilized as an epoxy curative, it can enhance thermal performance compared to monoanhydrides and aromatic amine curing agents. Its application areas include electronics encapsulation, composites, and adhesives. Dianhydrides & Imides BISDA-derived polyimide varnishes, coatings, adhesives, films, and wire enamels offer desired solubility and stability in organic solvents even after complete imidization, heat resistance, flexibility/softness, dimensional stability, and adhesion properties for the ever-increasing design complexity of electronic devices. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Properties

Physical Form: Flakes
Solid

Other characteristics

Brand: Dianhydrides & Imides
Labeling Claims: No Added PFAS
Markets: Adhesives & Sealants
Automotive & Transportation
Consumer Goods
Electrical & Electronics
Industrial
Coating Type: Enamel
Varnishes
Technology: Base Chemicals & Intermediates
CASE Ingredients
Benefits: BISDA (BPA based dianhydride) has excellent thermal properties that may be used as a co-monomer in Polyimide synthesis or as a curing agent in epoxy thermoset systems. BISDA is provided as a flake and is soluble in the typical organic solvents used in polyimide varnishes, coatings, adhesives, films and wire enamels. Incorporating BISDA into polyimide formulations may provide enhanced performance in: heat resistance, flexibility/softness, dimensional stability and metal adhesion properties. In epoxy systems, BISDA as a curing agent may offer improved thermal performance, increased pot life, easier handling, improved chemical resistance, better toughness, lower dielectric properties, lower shrinkage and lower moisture absorption.
Material Features: Unreinforced
Applicable Processes: Electronics Encapsulation
Country Availability: Brazil
Canada
China (Mainland)
Mexico
USA

Technical data

Table 1 of 2

2 rows

Characteristic	Value	Unit	Method
Mw	520.49	—	SABIC method
Solubility (In Methyl Ethyl Ketone, at 75°C)	10	Wt. %	SABIC method

Table 2 of 2