LNP™ KONDUIT™ Compound DTK22

Chemical Family: Polycarbonate (PC)

LNP KONDUIT DTK22 compound is based on Polycarbonate (PC) resin containing minerals. Added features of this grade include: Thermally Conductive and Electrically Insulative.

Product families

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Automotive Lighting

Building & Construction — Building Envelope & Roofing

Glazing & Window Elements

Building & Construction — Building Materials

Interior Fixtures

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Electrical & Electronics — Devices & Assemblies

Automotive Electronics
Consumer Electronics
Displays
Industrial Automation
Lighting

Electrical & Electronics — Parts & Components

Housings & Enclosures

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics
Polycarbonates

Other characteristics

Brand: LNP™ KONDUIT™ Compound
Polymer Name: Polycarbonate (PC)
Fillers Included: Mineral, Talc, Titanium Dioxide
Mineral
Talc
Titanium Dioxide
Flexural Modulus: 4180.0 - 4180.0 MPa
Additives Included: Flame Retardant, Heat Stabilizer, Mold Release Agent; Flame Retardant; Heat Stabilizer; Mold Release Agent
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Automotive & Transportation
Building & Construction
Consumer Goods
Electrical & Electronics
Industrial
Flame Rating: UL 94 HB
Technology: Plastics
Material Features: Conductive
Electrically Insulating
Electrically Isolative
Flame Retardant
Good Heat Dissipation
Good Mold Release
Good Moldability
Good Processability
Certifications and Compliance: UL 94
Plastics and Elastomers End Uses: Appliances
Automotive Electronics
Building Materials
Camera Applications
Cell Phones
Computer Components
Construction Applications
Consumer Applications
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 7

12 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	41	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	5	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	3830	MPa	ASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹	79	MPa	ASTM D790
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	77	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	3160	MPa	ASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹	42	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	4.1	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	3880	MPa	ISO 527
Flexural Stress (Break, 2 mm/min) ¹¹	81	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	4180	MPa	ISO 178
Impact Strength ¹¹	13 - 48	kJ/m²	ISO R179

Table 2 of 7

4 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.46	g/cm³	ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.41	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.39	%	ASTM D955
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.03	%	ISO 62

Table 3 of 7

13 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm) ¹¹	127	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2 mm) ¹¹	121	°C	ASTM D648
Coefficient of Thermal Expansion (at 40°C to 120°C, flow) ¹¹	0.000053	1/°C	ASTM E831
Coefficient of Thermal Expansion (at 40°C to 120°C, xflow) ¹¹	0.000085	1/°C	ASTM E831
Thermal Conductivity (through-plane, 60603mm plaque) ¹¹	0.3	W/m-K	ISO 22007-2
Thermal Conductivity (in-plane, 60603mm plaque) ¹¹	1.3	W/m-K	ISO 22007-2
Thermal Conductivity (through-plane, 10103mm sample) ¹¹	0.6	W/m-K	ASTM E1461-07
Thermal Conductivity (in-plane, 25*0.4mm disc) ¹¹	2	W/m-K	ASTM E1461-07
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	128	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	119	°C	ISO 75/Af
Relative Temperature Index (Electrical) ᵖ ¹¹	80	°C	UL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹	80	°C	UL 746B

Table 4 of 7

2 rows

Characteristic	Value	Method
Dielectric Constant (at 1.1 GHz) ¹¹	3.66	ASTM ES 7-83
Dissipation Factor (at 1.1 GHz) ¹¹	0.0094	ASTM ES 7-83

Table 5 of 7