LNP™ STAT-KON™ Compound EX02598C
- Chemical Family
- Polyetherimide (PEI)Polyimides (PI)
SABIC's Specialties Business LNP™ STAT-KON™ EX02598C compound is based on Polyetherimide (PEI) resin containing carbon nanotube. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Equipment & Parts
- Consumer Electronics
- Displays
- Industrial Automation
- Connectors
- Semiconductor Manufacturing
- Switches & Relays
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ STAT-KON™ Compound
- Polymer Name
- Polyether Imide (PEI)
- Fillers Included
- Carbon Nanotube
- Flexural Modulus
- 3110.0 - 3110.0 MPa
- Additives Included
- Heat Stabilizer
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Material Features
- Dimensional Stability
- ESD Protection
- Electrically Conductive
- Heat Stabilized
- High Temperature Resistance
- Low Liquid Particle Count
- Low Outgassing
- Very Good Heat Resistance
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Cell Phones
- Computer Components
- Displays
- Electrical Components
- Electrical/Electronic Applications
- Industrial Applications
- Semiconductor Applications
- Tablets
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 52 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 1.7 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 3410 | MPa | ASTM D638 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 98 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 3310 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 60 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 2.1 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 3240 | MPa | ISO 527 |
| Flexural Stress ¹¹ | 72 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 3110 | MPa | ISO 178 |
Table 2 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.27 | — | ASTM D792 |
| Density ¹¹ | 1.26 | g/cm³ | ASTM D792 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.6 - 0.8 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.7 - 0.9 | % | ASTM D955 |
Table 3 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 172 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 163 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹ | 0.00005 | 1/°C | ASTM D696 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹ | 0.000054 | 1/°C | ASTM D696 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 171 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 160 | °C | ISO 75/Af |
Table 4 of 6
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity ¹¹ | 1000 - 1000000 | Ω | ASTM D257 |
Table 5 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 266 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 19 | J/m | ASTM D256 |
| Instrumented Dart Impact Total Energy (at 23°C) ¹¹ | 2 | J | ASTM D3763 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 18 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 2 | kJ/m² | ISO 180/1A |
Table 6 of 6
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Extended Drying Temperature ⁷ | 150 | °C |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 360 - 400 | °C |
| Rear - Zone 1 Temperature ⁷ | 360 - 380 | °C |
| Middle - Zone 2 Temperature ⁷ | 370 - 390 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 400 | °C |
| Nozzle Temperature ⁷ | 390 - 400 | °C |
| Mold Temperature ⁷ | 140 - 180 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed (Circumferential speed) ⁷ | 0.2 - 0.3 | m/s |
| Vent Depth ⁷ | 0.025 - 0.076 | mm |
