LNP™ THERMOTUF™ Compound WF008NXQ
- Chemical Family
- Polyesters
SABIC's Specialties Business LNP THERMOTUF WF008NXQ compound is based on Polybutylene Terephthalate (PBT) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Impact Modified, Good Metal Bonding Strength and Good Chemical Resistance suitable for Nano-Molding Technology (NMT) applications and Good Color Stability during anodizing process. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Switches & Relays
Product Families
- Polyesters & Copolyesters
Other characteristics
- Brand
- LNP™ THERMOTUF™ Compound
- Polymer Name
- Polybutylene Terephthalate (PBT)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 11200.0 - 11200.0 MPa
- Additives Included
- Impact Modifier
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Chemical Resistant
- Good Adhesion
- Good Bonding Strength
- Good Color Stability
- High Impact Resistance
- High Modulus
- High Stiffness
- Impact Modified
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Building Materials
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Electrical/Electronic Applications
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 7
18 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 215 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 11000 | MPa | ASTM D790 |
| Flexural Stress (Break, 2.6 mm/min, 100 mm span) ¹¹ | 200 | MPa | ASTM D790 |
| Flexural Modulus (at 2.6 mm/min, 100 mm span) ¹¹ | 10400 | MPa | ASTM D790 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 12500 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 2.6 | % | ASTM D638 |
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 140 | MPa | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 12400 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 2.7 | % | ASTM D638 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹¹ | 152 | MPa | ASTM D638 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 210 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 11200 | MPa | ISO 178 |
Table 2 of 7
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.6 | g/cm³ | ASTM D792 |
| Melt Flow Rate (at 275°C, 2.16 kgf) ¹¹ | 14 | g/10 min | ASTM D1238 |
| Melt Flow Rate (at 275°C, 5 kgf) ¹¹ | 43 | g/10 min | ASTM D1238 |
| Melt Volume Rate (at 280°C, 2.16 kg) ¹¹ | 12 | cm³/10 min | ISO 1133 |
| Melt Volume Rate (at 275°C, 5 kg) ¹¹ | 31 | cm³/10 min | ISO 1133 |
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.25 | % | SABIC method |
| Mold Shrinkage (xflow) ᵍ ¹¹ | 0.51 | % | SABIC method |
Table 3 of 7
13 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 221 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 205 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 6.4 mm, Unannealed) ¹¹ | 210 | °C | ASTM D648 |
| Vicat Softening Temperature (Rate B/50) ¹¹ | 210 | °C | ASTM D1525 |
| Vicat Softening Temperature (Rate B/50) ¹¹ | 208 | °C | ISO 306 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 204 | °C | ISO 75/Af |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000019 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000019 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000072 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000069 | 1/°C | ASTM E831 |
| Relative Temperature Index (Electrical) ᵖ ¹¹ | 75 | °C | UL 746B |
| Relative Temperature Index (Mechanical with impact) ᵖ ¹¹ | 75 | °C | UL 746B |
Table 4 of 7
10 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹¹ | 3.85 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.0102 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 3.84 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.0097 | SABIC method |
| Dielectric Constant (at 5 GHz) ¹¹ | 3.81 | SABIC method |
| Dissipation Factor (at 5 GHz) ¹¹ | 0.0093 | SABIC method |
| Dielectric Constant (at 10 GHz) ¹¹ | 3.84 | SABIC method |
| Dissipation Factor (at 10 GHz) ¹¹ | 0.0085 | SABIC method |
| Dielectric Constant (at 20 GHz) ¹¹ | 3.82 | SABIC method |
| Dissipation Factor (at 20 GHz) ¹¹ | 0.0091 | SABIC method |
Table 5 of 7
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 130 | J/m | ASTM D256 |
| Izod Impact (Notched, at -30°C) ¹¹ | 97 | J/m | ASTM D256 |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 890 | J/m | ASTM D4812 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 52 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 12 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched, 80*10*4, at -30°C) ¹¹ | 9.5 | kJ/m² | ISO 180/1A |
| Charpy Impact (Notched, at 23°C) ¹¹ | 12.5 | kJ/m² | ISO 179/2C |
| Charpy Impact (Notched, at -30°C) ¹¹ | 10 | kJ/m² | ISO 179/2C |
| Charpy Impact (Unnotched, at 23°C) ¹¹ | 60 | kJ/m² | ISO 179/2C |
Table 6 of 7
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 100 - 120 | °C |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 260 - 280 | °C |
| Nozzle Temperature ⁷ | 265 - 280 | °C |
| Front - Zone 3 Temperature ⁷ | 250 - 270 | °C |
| Middle - Zone 2 Temperature ⁷ | 250 - 270 | °C |
| Rear - Zone 1 Temperature ⁷ | 240 - 260 | °C |
| Hopper Temperature ⁷ | 40 - 60 | °C |
| Mold Temperature ˡ ⁷ | 100 - 150 | °C |
Table 7 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94HB Flame Class Rating) ᵖ | min. 0.8 | mm | UL 94 |
