LNP™ THERMOTUF™ Compound WF006NiQ

Chemical Family: Polyesters

SABIC's Specialties Business LNP™ THERMOTUF™ Compound WF006NiQ is a high-quality material based on polybutylene terephthalate (PBT) resin that utilizes ELCRIN iQ upcycling technology and contains 30% glass fiber. This grade is impact modified, has high flow, good metal bonding strength, and good chemical resistance, making it suitable for nano-molding technology (NMT) applications. It also contains more than 25% post-consumer recycled content, making it an eco-friendly choice for manufacturers. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Other characteristics

Brand: LNP™ THERMOTUF™ Compound
Density: 1490.0 - 1490.0 kg/m³
Polymer Name: Polybutylene Terephthalate (PBT)
Labeling Claims: Contains PCR Resin, No Added PFAS, Recycled, Sustainable; Contains PCR Resin; No Added PFAS; Recycled; Sustainable
Fillers Included: Glass Fiber
Additives Included: Impact Modifier
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Automotive & Transportation
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Flame Rating: UL 94 HB
Technology: Plastics
Material Features: Chemical Resistant
Good Adhesion
Good Bonding Strength
Good Color Stability
High Flow
High Flowability
High Impact Resistance
High Stiffness
Country Availability: Canada
China (Mainland)
Mexico
USA
Potential Applications: PBT based LNP THERMOTUF™ compounds may be qualified to use in consumer electronics and consumer applications for combination of dimensional stability, mechanical performance and bonding strength.
Certifications and Compliance: UL 94

Technical data

Table 1 of 7

11 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	110	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	2.5	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	8760	MPa	ASTM D638
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	170	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	7.70E+03	MPa	ASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹	111	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2.5	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	8600	MPa	ISO 527
Flexural Stress (Break, 2 mm/min) ¹¹	168	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	7100	MPa	ISO 178
Bonding Strength ("T" treatment, Shear type) ¹¹	33	MPa	ISO 19095

Table 2 of 7

8 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.49	g/cm³	ISO 1183
Melt Flow Rate (at 250°C, 5 kgf) ¹¹	21	g/10 min	ASTM D1238
Melt Flow Rate (at 275°C, 5 kgf) ¹¹	37	g/10 min	ASTM D1238
Melt Volume Rate (at 250°C, 5 kg) ¹¹	15	cm³/10 min	ISO 1133
Melt Volume Rate (at 275°C, 5 kg) ¹¹	29	cm³/10 min	ISO 1133
Melt Volume Rate (at 270°C, 5 kg) ¹¹	23	cm³/10 min	ISO 1133
Mold Shrinkage (flow) ᵍ ¹¹	0.2 - 0.3	%	SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹	0.4 - 0.5	%	SABIC method

Table 3 of 7

15 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	162	°C	ASTM D648
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	204	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	156	°C	ISO 75/Af
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	200	°C	ISO 75/Bf
Coefficient of Thermal Expansion (at 23°C to 50°C, flow) ¹¹	0.000024	1/°C	ASTM E831
Coefficient of Thermal Expansion (at 23°C to 50°C, flow) ¹¹	0.000023	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 50°C, xflow) ¹¹	0.00009	1/°C	ASTM E831
Coefficient of Thermal Expansion (at 23°C to 50°C, xflow) ¹¹	0.000096	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000024	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000023	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000081	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000086	1/°C	ISO 11359-2

Table 4 of 7

8 rows

Characteristic	Value	Method
Dielectric Constant (at 1.1 GHz) ¹¹	3.61	SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹	0.013	SABIC method
Dielectric Constant (at 1.9 GHz) ¹¹	3.62	SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹	0.012	SABIC method
Dielectric Constant (at 5 GHz) ¹¹	3.59	SABIC method
Dissipation Factor (at 5 GHz) ¹¹	0.01	SABIC method
Dielectric Constant (at 10 GHz) ¹¹	3.53	SABIC method
Dissipation Factor (at 10 GHz) ¹¹	0.009	SABIC method

Table 5 of 7

6 rows

Characteristic	Value	Unit	Method
Izod Impact (Unnotched, at 23°C) ¹¹	870	J/m	ASTM D4812
Izod Impact (Notched, at 23°C) ¹¹	137	J/m	ASTM D256
Izod Impact (Notched, at -30°C) ¹¹	100	J/m	ASTM D256
Izod Impact (Unnotched, 80104, at 23°C) ¹¹	54	kJ/m²	ISO 180/1U
Izod Impact (Notched, 80104, at 23°C) ¹¹	13	kJ/m²	ISO 180/1A
Izod Impact (Notched, 80104, at -30°C) ¹¹	10	kJ/m²	ISO 180/1A

Table 6 of 7