LNP™ THERMOTUF™ Compound WF008N

Chemical Family: Polyesters

SABIC's Specialties Business LNP THERMOTUF WF008N compound is based on Polybutylene Terephthalate (PBT) resin containing 40% glass fiber. Added features of this grade include: Impact Modified, Good Metal Bonding Strength and Good Chemical Resistance suitable for Nano-Molding Technology (NMT) applications. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polyesters & Copolyesters

Other characteristics

Brand: LNP™ THERMOTUF™ Compound
Polymer Name: Polybutylene Terephthalate (PBT)
Fillers Included: Glass Fiber
Flexural Modulus: 11200.0 - 11200.0 MPa
Additives Included: Impact Modifier
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Flame Rating: UL 94 HB
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Chemical Resistant
Good Adhesion
Good Bonding Strength
High Flowability
High Impact Resistance
High Stiffness
High Strength
Impact Modified
Country Availability: Canada
China (Mainland)
Mexico
USA
Certifications and Compliance: UL 94
Plastics and Elastomers End Uses: Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Electrical Components
Electrical/Electronic Applications
Personal Accessories
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 7

11 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	133	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	2.4	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	11600	MPa	ASTM D638
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	205	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	11000	MPa	ASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹	134	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2.5	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	11700	MPa	ISO 527
Flexural Stress (Break, 2 mm/min) ¹¹	217	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	11200	MPa	ISO 178
Bonding Strength ("T" treatment, Shear type) ¹¹	34	MPa	ISO 19095

Table 2 of 7

7 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.58	g/cm³	ISO 1183
Melt Flow Rate (at 250°C, 5 kgf) ¹¹	10	g/10 min	ASTM D1238
Melt Flow Rate (at 275°C, 5 kgf) ¹¹	22	g/10 min	ASTM D1238
Melt Volume Rate (at 250°C, 5 kg) ¹¹	7	cm³/10 min	ISO 1133
Melt Volume Rate (at 275°C, 5 kg) ¹¹	15	cm³/10 min	ISO 1133
Mold Shrinkage (flow) ᵍ ¹¹	0.25	%	SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹	0.65	%	SABIC method

Table 3 of 7

15 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	193	°C	ASTM D648
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	217	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	196	°C	ISO 75/Af
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	218	°C	ISO 75/Bf
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000018	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000019	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000086	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000087	1/°C	ASTM E831
Coefficient of Thermal Expansion (at 23°C to 50°C, flow) ¹¹	0.000017	1/°C	ASTM E831
Coefficient of Thermal Expansion (at 23°C to 50°C, flow) ¹¹	0.000017	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 50°C, xflow) ¹¹	0.00009	1/°C	ASTM E831
Coefficient of Thermal Expansion (at 23°C to 50°C, xflow) ¹¹	0.000089	1/°C	ISO 11359-2

Table 4 of 7

8 rows

Characteristic	Value	Method
Dielectric Constant (at 1.1 GHz) ¹¹	3.78	SABIC method
Dielectric Constant (at 1.9 GHz) ¹¹	3.76	SABIC method
Dielectric Constant (at 5 GHz) ¹¹	3.73	SABIC method
Dielectric Constant (at 10 GHz) ¹¹	3.8	SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹	0.0104	SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹	0.0096	SABIC method
Dissipation Factor (at 5 GHz) ¹¹	0.0091	SABIC method
Dissipation Factor (at 10 GHz) ¹¹	0.0082	SABIC method

Table 5 of 7

6 rows

Characteristic	Value	Unit	Method
Izod Impact (Unnotched, at 23°C) ¹¹	960	J/m	ASTM D4812
Izod Impact (Notched, at 23°C) ¹¹	145	J/m	ASTM D256
Izod Impact (Notched, at -30°C) ¹¹	106	J/m	ASTM D256
Izod Impact (Unnotched, 80104, at 23°C) ¹¹	59	kJ/m²	ISO 180/1U
Izod Impact (Notched, 80104, at 23°C) ¹¹	14	kJ/m²	ISO 180/1A
Izod Impact (Notched, 80104, at -30°C) ¹¹	11	kJ/m²	ISO 180/1A

Table 6 of 7