LNP™ COLORCOMP™ Compound GX02708H
- Chemical Family
- Polysulfones
SABIC's Specialties Business LNP COLORCOMP GX02708H compound is based on Polysulfone (PSU) resin. Added features of this grade include: Healthcare. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Medical Devices & Assemblies
- Surgical Instruments & Trays
- Healthcare Packaging
- Industrial & Transport Packaging
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ COLORCOMP™ Compound
- Polymer Name
- Polysulfone (PSU)
- Processing Methods
- Injection Molding
- Note
⁷ Параметры литья под давлением указаны только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных изделий и газовое литье.. ¹¹ Информация, указанная в технических паспортах, должна использоваться только для целей выбора материала и не должна применяться в качестве спецификации или использоваться для проектирования деталей или пресс-форм.
- Color
- Custom
- Markets
- Healthcare & Pharma
- Printing & Packaging
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Excellent Aesthetics
- Good Aesthetics
- Good Surface Appearance
- High Temperature Resistance
- No Added PFAS
- Unreinforced
- Very Good Heat Resistance
- Plastics and Elastomers End Uses
- Medical Devices
- Medical Packaging
- Medical/Healthcare Applications
- Pharmaceutical Packaging
- Surgical Devices
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.24 | — | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.3 | % | ASTM D570 |
Table 2 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 174 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹ | 0.000056 | 1/°C | ASTM D696 |
Table 3 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Strength (at 1.6mm) ¹¹ | 130 | kV/mm | ASTM D149 |
| Dissipation Factor (at at 1 MHz) ¹¹ | 0.006 | — | ASTM D150 |
Table 4 of 5
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 - 150 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.05 | % |
| Melt Temperature ⁷ | 360 - 370 | °C |
| Front - Zone 3 Temperature ⁷ | 350 - 360 | °C |
| Middle - Zone 2 Temperature ⁷ | 340 - 350 | °C |
| Rear - Zone 1 Temperature ⁷ | 325 - 340 | °C |
| Mold Temperature ⁷ | 150 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
Table 5 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Oxygen Index (LOI) | 26 | % | ASTM D2863 |
