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Aegis® H55C2ZP

Chemical Family
Polyamides

Aegis® H55C2ZP is a 2.7 RV, unfilled, medium viscosity, non-lubricated, polyamide 6/66 copolymer for molding or compounding. With a broad processing window and excellent melt fluidity for filling thin sections, it provides exceptional processability. Aegis® H55C2ZP resin combines strength, stiffness and toughness with chemical and abrasion resistance. For glass- or mineral-filled applications, Aegis® H55C2ZP resin also offers superior surface appearance and low warp.

Product families

Applications

Automotive & Transportation — Automotive
  • Aftermarket Parts & Components
  • Interior
  • Powertrain & UTH
Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts
Printing & Packaging — Packaging
  • Industrial & Transport Packaging
Industrial — Paper & Pulp
  • Coated Paper & Paperboard

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
Aegis®
Polymer Name
Polyamide 6/66 (PA 6/66)
Processing Methods

Compounding, Extrusion, Extrusion Coating, Injection Molding

Markets
  • Automotive & Transportation
  • Industrial
  • Printing & Packaging
Technology
Plastics
Material Features
  • Excellent Melt Flow
  • Good Processability
  • Good Surface Appearance
  • Low Warpage
  • Slow Crystallization
Packaging Information

Aegis® H55C2ZP is a copolyamide compounding grade available today in commercial quantities, and can be supplied in either bag or Gaylord packaging. It is fully qualified in production on our flexible polymerization asset, as well as in downstream use.

Processing Guidelines

Material Handling; Maximum Water Content: 0.12%; Aegis® H55C2ZP copolyamide resin is supplied in sealed containers and drying prior to processing is not required. However, high moisture is the primary cause of processing issues. If drying becomes necessary, a dehumidifying or desiccant dryer operating at 80°C (176°F) is recommended. Drying time is dependent on moisture level.; Recommended Melt Temperature Range; Melt Temperature: Recommended range is 230-275°C (446-527°F); Typical Extrusion Temperature Profile; Barrel: 239-256°C (462-493°F Adapter: 250-256°C (482-493°F) Die: 250-256°C (482-493°F) Process Melt Temperature: 250-260°C (482-500°F); Screw Parameters; Metering Section: 40% Transition Section: 3 to 4 flights Feed Section: Balance of screw length Compression Ratio: 3.5:1 to 4.0:1 L/D Ratio: 24:1; Metering Section Flight Depth

Plastics and Elastomers End Uses
  • Automotive Applications
  • Film
  • Flexible Packaging
  • Food Packaging
  • Form Fill Seal Packaging
  • Gears
  • Industrial Applications
  • Levers
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
  • Compounding
  • Extrusion
  • Extrusion Coating
  • Injection Molding
Typical Performance Comparison (30% GF Reinforced Parts)

O = Baseline DAM = Dry as Molded COND = 2.7% H2 O

Technical data

Table 1 of 2

4 rows
CharacteristicValueUnitMethod
Extractablesmax. 0.8%SOP-702-307
FA Viscosity53—D-789
Moisture Contentmax. 0.10%D-6869
Yellowness Index (YI)max. -1MCAMDE-313

Table 2 of 2

12 rows
CharacteristicValueUnitMethod
Tensile Modulus2,500/850MPaASTM D-638
Elongation at Break (Conditioned)min. 200%ASTM D-638
Tensile Strength at Yield77/38MPaASTM D-638
Elongation at Break (DAM)37%ASTM D-638
Flexural Strength105/33MPaASTM D-790
Flexural Modulus2,504/630MPaASTM D-790
Notched Izod Impact37/320J/mASTM D-256
HD (at 0.45 MPa)133 (271.4)°C (°F)ASTM D-648
HD (at 1.8 MPa)61 (141.8)°C (°F)ASTM D-648
Mold Shrink - MD (at 48 hrs)0.94%ASTM D-955
Mold Shrink - TD (48 hrs)1.03%ASTM D-955
Density1.11g/cm3ASTM D-792

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