LNP™ COLORCOMP™ Compound DX04401H

Chemical Family: Polycarbonate (PC)

LNP COLORCOMP DX04401H compound is based on Polycarbonate (PC) resin. Added features of this grade include: Healthcare.

Product families

Applications

Healthcare & Pharma — Medical

Medical Devices & Assemblies
Surgical Instruments & Trays

Printing & Packaging — Packaging

Healthcare Packaging
Industrial & Transport Packaging

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics
Polycarbonates

Other characteristics

Brand: LNP™ COLORCOMP™ Compound
Polymer Name: Polycarbonate (PC)
Flexural Modulus: 2400.0 - 2400.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Color: Custom
Markets: Healthcare & Pharma
Printing & Packaging
Technology: Plastics
Material Features: Excellent Aesthetics
Good Aesthetics
Good Surface Appearance
High Durability
Unreinforced
Plastics and Elastomers End Uses: Medical Devices
Medical Packaging
Medical/Healthcare Applications
Pharmaceutical Packaging
Surgical Devices
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 7

11 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield, 50 mm/min) ¹¹	62	MPa	ASTM D638
Tensile Stress (Break, 50 mm/min) ¹¹	68	MPa	ASTM D638
Tensile Strain (Yield, at 50 mm/min) ¹¹	6	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	2210	MPa	ASTM D638
Hardness (Rockwell R) ¹¹	118	—	ASTM D785
Tensile Stress (Yield) ¹¹	62	MPa	ISO 527
Tensile Stress (Break) ¹¹	68	MPa	ISO 527
Tensile Strain (Yield) ¹¹	6	%	ISO 527
Tensile Strain (Break) ¹¹	150	%	ISO 527
Flexural Stress ¹¹	98	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	2400	MPa	ISO 178

Table 2 of 7

5 rows

Characteristic	Value	Unit	Method
Specific Gravity ¹¹	1.2	—	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.15	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.5 - 0.5	%	ASTM D955
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.32	%	ISO 62
Melt Volume Rate (at 300°C, 1.2 kg) ¹¹	12	cm³/10 min	ISO 1133

Table 3 of 7

2 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	122	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	120	°C	ISO 75/Af

Table 4 of 7

4 rows

Characteristic	Value	Unit	Method
Volume Resistivity ¹¹	2.00E+17	Ω.cm	ASTM D257
Dielectric Constant (at 1 MHz) ¹¹	3	—	ASTM D150
Dissipation Factor (at 100 Hz) ¹¹	0.001	—	ASTM D150
Dissipation Factor (at at 1 MHz) ¹¹	0.002	—	ASTM D150

Table 5 of 7