LNP™ STAT-KON™ Compound DEL22P

Chemical Family: Polycarbonate (PC)

SABIC's Specialties Business LNP™ STAT-KON™ DEL22P compound is based on Polycarbonate (PC) resin containing 10% carbon fiber, 10% PTFE. Added features of this grade include: Electrically Conductive. Exceptional Processing, Wear Resistant.

Product families

Applications

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Electrical & Electronics — Devices & Assemblies

Industrial Automation

Electrical & Electronics — Parts & Components

Semiconductor Manufacturing

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics
Polycarbonates

Other characteristics

Brand: LNP™ STAT-KON™ Compound
Polymer Name: Polycarbonate (PC)
Fillers Included: Carbon Fiber, PTFE
Carbon Fiber
PTFE
Flexural Modulus: 5690.0 - 5690.0 MPa
Additives Included: Lubricant (PTFE), Mold Release Agent
Lubricant (PTFE)
Mold Release Agent
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Electrical & Electronics
Industrial
Technology: Plastics
Material Features: ESD Protection
Electrically Conductive
Friction Resistant
Good Mold Release
Good Processability
High Flowability
High Stiffness
High Strength
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Electrical/Electronic Applications
Industrial Applications
Semiconductor Applications
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

8 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break) ¹¹	100	MPa	ASTM D638
Tensile Stress (Break) ¹¹	101	MPa	ISO 527
Tensile Strain (Break) ¹¹	2	%	ASTM D638
Tensile Strain (Break) ¹¹	2	%	ISO 527
Tensile Modulus (at 50 mm/min) ¹¹	7900	MPa	ASTM D638
Flexural Stress ¹¹	152	MPa	ASTM D790
Flexural Modulus ¹¹	5690	MPa	ASTM D790
Tensile Modulus (at 1 mm/min) ¹¹	8170	MPa	ISO 527

Table 2 of 6

11 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.3	g/cm³	ISO 1183
Density ¹¹	1.3	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.1	%	ASTM D570
Mold Shrinkage (flow, 0.75-2.3 mm) ᵍ ¹¹	0.1 - 0.3	%	SABIC method
Mold Shrinkage (flow) ᵍ ¹¹	0.1 - 0.3	%	SABIC method
Mold Shrinkage (xflow, 0.75-2.3 mm) ᵍ ¹¹	0.4 - 0.6	%	SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹	0.4 - 0.6	%	SABIC method
Wear Factor Washer ¹¹	15	10^-10 in^5-min/ft-lb-hr	ASTM D3702 Modified: Manual
Dynamic COF ¹¹	0.55	—	ASTM D3702 Modified: Manual
Static COF ¹¹	0.52	—	ASTM D3702 Modified: Manual
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.18	%	ISO 62

Table 3 of 6

6 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	134	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000014	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000015	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000076	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000076	1/°C	ISO 11359-2
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	143	°C	ISO 75/Af

Table 4 of 6

2 rows

Characteristic	Value	Unit	Method
Volume Resistivity ¹¹	100	Ω.cm	IEC 60093
Surface Resistivity (ROA) ¹¹	100 - 1000000	Ω	IEC 60093

Table 5 of 6