LNP™ THERMOCOMP™ Compound DF0041VI
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP™ THERMOCOMP™ DF0041VI compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, Wide Processing Window.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polycarbonates
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 6400.0 - 6400.0 MPa
- Additives Included
Flame Retardant, Heat Stabilizer, Mold Release Agent; Flame Retardant; Heat Stabilizer; Mold Release Agent
- Processing Methods
- Injection Molding, Laser Sintering (SLS)
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Labeling Claims
- Bromine-free
- Chlorine-free
- Material Features
- Cost Effective
- Excellent Dielectric Properties
- Fast Plating
- Flame Retardant
- Good Mold Release
- Heat Stabilized
- High Stiffness
- Non-brominated
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Building Materials
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Doors
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Laser Sintering (SLS)
Technical data
Table 1 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.4 | g/cm³ | ASTM D792 |
| Melt Flow Rate (at 300°C, 2.16 kgf) ¹¹ | 17 | g/10 min | ASTM D1238 |
| Melt Flow Rate (at 300°C, 1.2 kgf) ¹¹ | 10 | g/10 min | ASTM D1238 |
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.2 - 0.4 | % | SABIC method |
| Mold Shrinkage (xflow) ᵍ ¹¹ | 0.2 - 0.4 | % | SABIC method |
Table 2 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 85 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 2.5 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 7000 | MPa | ASTM D638 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 6000 | MPa | ASTM D790 |
| Flexural Strength (at 1.3 mm/min, 50 mm span) ¹¹ | 125 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 86 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 2.5 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 6900 | MPa | ISO 527 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 6400 | MPa | ISO 178 |
| Flexural Strength (at 2 mm/min) ¹¹ | 130 | MPa | ISO 178 |
Table 3 of 6
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 124 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 118 | °C | ASTM D648 |
Table 4 of 6
10 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹¹ | 3.367 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.008 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 3.363 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.005 | SABIC method |
| Dielectric Constant (at 5 GHz) ¹¹ | 3.347 | SABIC method |
| Dissipation Factor (at 5 GHz) ¹¹ | 0.007 | SABIC method |
| Dielectric Constant (at 10 GHz) ¹¹ | 3.323 | SABIC method |
| Dissipation Factor (at 10 GHz) ¹¹ | 0.007 | SABIC method |
| Dielectric Constant (at 20 GHz) ¹¹ | 3.157 | SABIC method |
| Dissipation Factor (at 20 GHz) ¹¹ | 0.007 | SABIC method |
Table 5 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 80 | J/m | ASTM D256 |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 450 | J/m | ASTM D4812 |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 8 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 26 | kJ/m² | ISO 180/1U |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹ | 8 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹ | 30 | kJ/m² | ISO 179/1eU |
Table 6 of 6
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 110 - 120 | °C |
| Drying Time ⁷ | 3 - 4 | Hrs |
| Melt Temperature ⁷ | 290 - 310 | °C |
| Nozzle Temperature ⁷ | 285 - 310 | °C |
| Front - Zone 3 Temperature ⁷ | 285 - 310 | °C |
| Middle - Zone 2 Temperature ⁷ | 285 - 310 | °C |
| Rear - Zone 1 Temperature ⁷ | 285 - 310 | °C |
| Mold Temperature ⁷ | 100 - 130 | °C |
| Back Pressure ⁷ | 0.1 - 0.3 | MPa |
| Screw Speed ⁷ | 50 - 150 | rpm |
